OLED (organic light emitting display) packaging method and OLED packaging structure

Abstract

The invention provides an OLED (organic light emitting display) packaging method and an OLED packaging structure. The OLED packaging method is combined with the frame glue packaging technology and the thin film packaging technology, organic layers coffered with frame glue can be limited in size, each organic layer is assuredly covered by an organic layer above the same completely, and packaging effect is improved; meanwhile, the organic layers can be prepared with one mask set, use amount of the masks is reduced, and production cost is saved. The OLED packaging structure is combined with the frame flue packaging structure and the thin film packaging structure, the organic layers coffered with the frame glue can be limited in size, the organic layers are assuredly covered with the organic layer above the same completely, good packaging effect is achieved, meanwhile, the organic layers can be prepared with one mask set, and production cost is low.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED packaging method and an OLED packaging structure. Background technique [0002] Organic Light Emitting Display (OLED) has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range, and can realize flexible display and With many advantages such as large-area full-color display, it is recognized by the industry as a display device with the most potential for development. [0003] According to the driving method, OLED can be divided into two categories: passive matrix OLED (Passive Matrix OLED, PMOLED) and active matrix OLED (Active Matrix OLED, AMOLED), namely direct addressing and thin film transistor matrix addressing. Among them, AMOLED has pixels arranged in an array, belongs to the active display type, has high luminous efficiency, and is usually use...

AI Technical Summary

Problems solved by technology

[0008] Commonly used thin film packaging structures such as figure 1 As shown, it includes multilayer inorganic layers 200 and multilayer organic layers 300 arranged alternately on the OLED device 100, and the areas of the multilayer inorganic layers 200 and multilayer organic layers 300 are equal. The advantage of this thin film encapsulation structure is that the preparation process Simple, only a single set of mask (Mask) is needed to complete the deposition of multi-layer inorganic layer 200, but the deposited inorganic layer 200 does not completely cover the organic layer 300, and the end of the organic layer 300 can be in contact with the air, providing a channel for water vapor to enter , thereby destroying the encapsulation effect

Therefore, another thin film packaging structure (such as figure 2 shown), which includes multiple layers of inorganic layers 200' and multiple layers of organic layers 300' alternately arranged on the OLED device 100'. The thin film encapsulation structure requires that the area of ​​the inorganic layer 200' above each organic layer 300' be equal. greater than the area of ​​the organic layer 300', so that each layer of organic layer 300' can be completely covered by the inorganic layer 200' above it, preventing water vapor from entering the device from the organic layer 300'. In the upward direction, the area of ​​the multi-layer inorganic layer 200' increases gradually, so multiple sets of masks are required to complete the deposition of the multi-layer inorganic layer 200'. During the preparation process, the mask board needs to be replaced many times, and the process is complicated. Easy to introduce uncontrollable factors

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