Semiconductor processing device and method

Abstract

The invention provides a semiconductor processing device, which comprises a first chamber part and a second chamber part, wherein the second chamber part can move relative to the first chamber part between an open position and a closed position; the first chamber part is provided with a groove channel, a first through hole communicating with a first position of the groove channel and a second through hole communicating with a second position of the groove channel, wherein the groove channel is formed by sinking from the inner wall surface, facing a micro-chamber, of the first chamber part. When the second chamber part is located at the closed position relative to the first chamber part and a to-be-treated semiconductor wafer is accommodated into the micro-chamber, one surface of the to-be-treated semiconductor wafer is propped against the inner wall surface of forming the groove channel, the groove channel forms a closed channel by virtue of a barrier of the surface of the to-be-treated semiconductor wafer at the moment and the closed channel communicates with the outside through the first through hole and the second through hole, so that the flow direction and the flow velocity of a treatment fluid can be accurately controlled, and the amount of the treatment fluid can also be greatly reduced.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of surface treatment of semiconductor wafers or similar workpieces, in particular to a semiconductor processing device and method. [0003] 【Background technique】 [0004] Chinese patents with patent numbers 201210171681.9 and 201210088237.0 both disclose a microchamber processing device for semiconductor wafer processing. The microchamber processing devices all include an upper chamber part and a lower chamber part, and the upper chamber part and the lower chamber part can be driven by a driving device to load and / or remove the opening of the semiconductor wafer. relative movement between a position and a closed position for receiving and processing the semiconductor wafer. When the upper chamber part and the lower chamber part are in the closed position, a microchamber is formed, and the semiconductor wafer is placed in the microchamber, and the upper chamber part and / or the lower chamber part include one o...

AI Technical Summary

Problems solved by technology

[0005] The upper working surface of the upper chamber part facing the microchamber and the lower working surface of the lower chamber part facing the microchamber are horizontal surfaces, and when the processing fluid passes through the microchamber When the inlet enters the microchamber to process the semiconductor wafer, the flow direction of the processing fluid is ran

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