Crimping method of welding-free high-airtight connector

A technology of high-density connectors and connectors, which is applied in the assembly/disassembly of contacts, etc., and can solve problems such as deformation, increased time cost, and high density
CN106785802AActive Publication Date: 2017-05-31武汉数字工程研究所
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
武汉数字工程研究所
Publication Date
2017-05-31

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Abstract

The invention discloses a crimping method of a welding-free high-airtight connector. The crimping method is characterized in the design of tooling clamps; each tooling clamp comprises a containing groove (6), a lower press die (5) and an upper press die (2); the tooling clamps are applied to the crimping of the connector to form the crimping method of the welding-free high-airtight connector. The crimping method has the advantages that the welding-free high-airtight connector can be quickly and accurately crimped; a plurality of welding-free high-airtight connectors can be crimped by one crimping process.
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Description

technical field

[0001] The invention relates to the technical field of circuit board assembly technology, in particular to a crimping method for a solder-free high-density connector. Background technique

[0002] At present, the connection between the solderless high-density connector and the printed circuit board is to crimp the pins of the connector into the holes of the printed circuit board by a press, forming an interference fit to make them tightly connected together, eliminating the need for previous The process of soldering after crimping saves labor and raw materials, improves efficiency, and also reduces the impact of high temperature on the printed circuit board during the soldering process, improving product quality. However, because the aperture on the printed circuit board to be crimped is too small, the number of pins of the connector is too large, and the density is too high. When crimping, the lower die is slightly deviated from the printed circuit board. On...

Claims

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