Alignment detection method and device for needle die and circuit board and alignment system
A technology of alignment detection and circuit board, applied in printed circuit testing, electronic circuit testing, etc., can solve the problems of no accuracy checking mechanism, etc., and achieve the effect of strong practicability
Inactive Publication Date: 2017-06-13
SHENZHEN YANMADE TECH CO LTD
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The advantage of this method is that it is simple and easy to implement; the disadvantage is that there is no accuracy checking mechanism, and it is not suitable for occasions with high precision requirements
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[0032] The present invention provides an alignment detection method, device and alignment system between a needle mold and a circuit board. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0033] The alignment detection method, device and alignment system of the needle mold and the circuit board provided by the invention make up for the shortcomings of the traditional scheme. The idea of the scheme is to combine the mechanical structure and the circuit. After the mechanical structure is crimped, use the method of electrical detection to judge whether the probe is accurate.
[0034] Specifically, please refer to figure 1 , the alignment detection device between the needle mold and the circuit board prov...
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The invention discloses an alignment detection method and device for a needle die and a circuit board and an alignment system. The detection method includes the steps that at least two pairs of wires are selected from the face, with a wire array, of the needle die, and the face, with a probe array, of the needle die and the face, with pin welding points of the circuit board are subjected to pressure welding, wherein two corresponding pins, on the circuit board, of each pair of selected wires is in a short circuit relation; whether the at least two pairs of selected wires are in the short circuit relation or not is detected, when it is detected that the at least two pairs of selected wires are in the short circuit relation, it is judged that the needle die and the circuit board are accurately aligned, otherwise, it is judged that the needle die and the circuit board are not accurately aligned. Therefore, alignment detection of the needle die and the circuit board is achieved. The detection mode is simple and reliable in implementation and high in practicality.
Description
technical field [0001] The invention relates to the testing field of circuit boards, in particular to a detection method, device and system for alignment between a needle mold and a circuit board. Background technique [0002] In the test of the circuit board, the pin signal of the circuit board under test needs to be led out at first, and the method is to use a needle mold to press and connect to the solder joint on the back of the pin group, and lead out the signal through the wire at the end of the needle mold. A pin pattern is an array of pins that are arranged and spaced to exactly match the pinout. [0003] At present, for the press alignment between the needle mold and the solder joint, the accuracy is generally ensured by means of mechanical structure limit guidance, such as: pins, guide posts, positioning holes, etc. The advantage of this method is that it is simple and easy to implement; the disadvantage is that there is no accuracy checking mechanism, and it is n...
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IPC IPC(8): G01R31/28
CPCG01R31/2808
Inventor 陈军
Owner SHENZHEN YANMADE TECH CO LTD