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Automatic parameter storage and calling method of semiconductor chip automatic packaging apparatus

A technology of packaging equipment and parameter storage, applied in general control systems, control/regulation systems, program control in sequence/logic controllers, etc. Convenience, clear status, and the effect of improving retrieval speed

Active Publication Date: 2017-06-20
TONGLING FUSHI SANJIA MACHINE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the existing automatic packaging equipment for semiconductor chips uses PLC as a parameter storage and calling medium, which has cumbersome operations, heavy workload, low work efficiency, and is prone to errors. Therefore, a fully automatic packaging of semiconductor chips is provided. Automatic parameter storage and call method of equipment

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  • Automatic parameter storage and calling method of semiconductor chip automatic packaging apparatus
  • Automatic parameter storage and calling method of semiconductor chip automatic packaging apparatus

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] Such as figure 1 , figure 2 As shown, the present invention includes three major steps, parameter data classification, data information management and operation of man-machine interface software of semiconductor chip automatic packaging equipment.

[0015] Parameter data classification: When operating the parameters of the semiconductor chip automatic packaging equipment, call the parameter storage and call program functions in the system respectively according to the instruction requirements. Since the parameter storage and call are all manually set or selected, so During the system cycle scan period, there is no need to increase the scan time to avoid affecting the normal operation of the system. Specifically: Divide all parameters in the system into functional data blocks according to their functions, each functional data block corresponds to a relatively ...

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Abstract

The invention discloses an automatic parameter storage and calling method of a semiconductor chip automatic packaging apparatus. The method includes the following steps of (1) parameter data classification; (2) data information management; (3) initialization operation; (4) parameter input; (5) input parameter determination; (6) variety copy: a number of functional data blocks in a database are divided into sub-function modules secondarily according to the usage function, and after receiving the copy instruction, the system analyzes the received instructions and determines the sub-function module data area needed to be copied to carry out the mutual reading and storage of the data blocks in different varieties. By using the database management parameters, the automatic parameter storage and calling problems of the automatic packaging apparatus are solved, and during the parameter setting and calling, a main program responds to apparatus parameter modification or call instructions, analyzes the stored and called parameter locations, and writes in or call the corresponding parameters from the database.

Description

technical field [0001] The invention relates to the field of full-automatic industrial manufacturing equipment, in particular to an automatic parameter storage and calling method of a semiconductor chip full-automatic packaging equipment. Background technique [0002] my country's semiconductor industry has maintained a rapid development trend. However, domestic packaging companies use manual or semi-automatic packaging based on single-cylinder molds to realize a fully automated production process, which is conducive to improving production efficiency and product quality. This is the development direction of my country's packaging industry. Packaging equipment is the process from semiconductor integrated circuit to packaging production process. Fully automatic packaging equipment realizes the operation of mechanical devices through electrical and intelligent equipment without manual intervention, and completes the whole process from loading, loading to receiving. Automate t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/05
CPCG05B19/054G05B2219/1103
Inventor 汪辉丁宁陈迎志曹玉堂徐善林方唐利丁丽成
Owner TONGLING FUSHI SANJIA MACHINE
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