Hot wire carrier and diamond film deposition equipment

A diamond thin film and deposition equipment technology, applied in metal material coating process, coating, gaseous chemical plating, etc., can solve the problems of high production cost, low production efficiency, and inability to flexibly control the hot wire, so as to reduce production cost , the effect of improving production efficiency

Active Publication Date: 2019-11-05
SHENZHEN INST OF ADVANCED TECH
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] In view of the defects existing in the prior art, the embodiment of the present invention provides a hot wire carrier frame and diamond film deposition equipment, which can solve the problem of inability to flexibly adjust the temperature field caused by the non-adjustable fixed hot wire in traditional diamond film deposition equipment. Problems of high production cost and low production efficiency

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  • Hot wire carrier and diamond film deposition equipment
  • Hot wire carrier and diamond film deposition equipment
  • Hot wire carrier and diamond film deposition equipment

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0022] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Ground connection, or integral connection; can be mechanical connection; can be directly connected, can also be indirectly connected through an intermediary, and can be i...

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Abstract

The invention discloses a hot wire bearing frame and diamond thin film deposition equipment. The hot wire bearing frame comprises a main frame body and a plurality of hot wires mounted on the main frame body, wherein the main frame body comprises two fixed frames which are arranged in parallel, and a plurality of connectors; the connectors are detachably arranged on the fixed frames, and can slide left and right in the horizontal direction on the fixed frames; the main frame body is connected to the hot wires through the connectors on the fixed frames; and the connectors are adjusted, so that quantity of hot wires mounted on the main frame body and spacing between every two mounted hot wires can be correspondingly adjusted. According to the hot wire bearing frame and the diamond thin film deposition equipment disclosed by the invention, the problems that production cost is low and production efficiency is difficult to improve as temperature fields cannot be flexibly adjusted when hot wires in conventional diamond thin film deposition equipment are fixed and are non-adjustable can be solved.

Description

technical field [0001] The invention relates to the field of chemical vapor deposition of diamond layers, in particular to the field of diamond film processing, in particular to a hot wire carrier for depositing diamond films and a diamond film deposition device for processing diamond films on milling cutters. Background technique [0002] The basic principle of preparing diamond film by hot wire vapor deposition method is as follows: the mixed gas of carbon source (such as methane, acetone, etc.) The metal heating wire generates heat to decompose the mixed gas and obtain various hydrocarbon groups required. Specifically, the mixed gas decomposes methyl groups and hydrogen atoms in the high temperature range formed by the metal hot wire, and under a certain pressure in the cavity, a large amount of methyl groups chemically react with the substrate surface at a suitable temperature, and a large amount of Complex recombination reactions occur between the methyl groups to gene...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/27C23C16/458C23C16/52
CPCC23C16/271C23C16/4581C23C16/52
Inventor 唐永炳张松全王陶
Owner SHENZHEN INST OF ADVANCED TECH
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