Anti-explosion hole realization method for printed circuit board
A technology for circuit boards and explosion-proof holes, which is applied to printed circuits, printed circuit manufacturing, and secondary treatment of printed circuits. It can solve problems affecting product appearance, blast holes, and high scrap rate, so as to achieve good finished products and prevent solder mask ink from overflowing. , The effect of reducing the scrap rate
Inactive Publication Date: 2017-07-04
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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Problems solved by technology
[0005] However, when the existing circuit boards are subjected to anti-soldering treatment, the problem of blast holes is prone to occur after heat-cured by anti-soldering
When there is a blast hole problem, the solder resist ink will overflow to the windowed pad and the windowed BGA through the blast hole, seriously affecting the appearance of the product, and the scrap rate is extremely high
Method used
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Embodiment 1
[0024] Such as figure 1 As shown, the present embodiment provides a circuit board explosion-proof hole method, comprising the following steps:
[0025] Step 101, printing: performing three processes on the circuit board in sequence, including pretreatment, plugging, and screen printing on the board surface;
[0026] Step 102, curing: the circuit boards in step 101 are subjected to standing, pre-baking, second resting, alignment, exposure, third resting, development, board inspection, second exposure, and thermal curing.
[0027] Preferably, the ink used in the plugging process is ink without adding diluent.
[0028] Preferably, 20-40ml / kg of diluent is added to the board ink used in the board screen printing process.
[0029] Preferably, in the plugging process, the plug hole printing is sequentially printed on the plug hole surface and the plug hole reverse surface.
[0030] Preferably, in the second exposure process, the exposure scale is at least 13 grids.
[0031] Pref...
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The invention relates to the technical field of production of a printed circuit board, particularly to an anti-explosion hole realization method for the printed circuit board. The anti-explosion hole realization method comprises the following steps of step 101, printing: performing three processes of preprocessing, hole plugging, board silk-screen printing and the like on the printed circuit board in sequence; and step 102, curing: performing the processes of standing, pre-baking, standing for the second time, alignment, exposure, static standing for the third time, developing, board inspection, exposure for the second time and thermal curing on the printed circuit board processed in the step 101 in sequence. By adoption of the technical scheme of the embodiment, the solder resist process and method of the existing printed circuit board are changed, so that the solder resist ink is cured gradually, and ink overflowing is prevented, a better finished product is achieved, and rejection rate is lowered.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for a circuit board explosion-proof hole. Background technique [0002] Printed Circuit Board (PCB), also known as printed circuit board, referred to as circuit board in the industry, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] Solder mask is one of the production processes in printed circuit boards, which is mainly used to protect the etched lines of circuit boards. In the production process of the circuit board, after the outer layer circuit manufacturing process is completed, the outer layer circuit must be protected against soldering to prevent the outer layer circuit from being oxidized or short-circuited during soldering. [0004] The existing solder resist...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/11
Inventor 冯发光李小王
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD