Method for preparing single-layer diamond abrasive tools by chemical vapor deposition

Abstract

The invention discloses a method for preparing a single-layer diamond abrasive tool through chemical vapor deposition. According to a silicon carbide base body, a diamond abrasive material is mixed into a photoresist solution and is subject to ultrasonic vibration, rotating whirl coating is used for evenly dispersing diamond abrasive particles, uniform distribution of the particles on a base body substrate can be achieved, the CVD method is adopted to enable the diamond coating bonding agent to be subject to deposition between the diamond abrasive particles and the silicon carbide base body, the abrasive material and the base body are firmly connected together, and meanwhile, the abrasive particles grow to become high-grade cubic octahedral single-crystal particles. The prepared single-layer diamond abrasive tool is high in abrasive particle holding force, the exposure height is large, the chipping containing space is large, defects of electroplating and brazing single-layer diamond abrasive tools are overcome, and the method is suitable for preparing fine granularity (five micrometers to 100 micrometers) single-layer diamond abrasive tools. The prepared single-layer diamond abrasive tool has the wide application prospect in high-precise grinding fields of crisp and hard materials of semiconductors, optical crystals, artificial sapphire, glass and the like

Description

technical field [0001] The invention relates to the technical field of preparation of diamond abrasive tools, in particular to a method for preparing single-layer diamond grinding tools by chemical vapor deposition (Chemical Vapor Deposition, CVD for short). Background technique [0002] At present, single-layer diamond abrasive tools include single-layer electroplated diamond tools and single-layer brazed diamond tools. Single-layer electroplated diamond abrasive tools lack firm metallurgical chemical bonding because the abrasive is actually mechanically embedded in the coating metal. Therefore, the holding force is not strong, and it is easy to fall off. In order to increase the holding force of the abrasive grains, the thickness of the coating is increased, the exposed height of the abrasive grains is low, the sharpness of the abrasive tool is poor, and the chip space is small, which is prone to clogging. The single-layer brazed diamond abrasive tools that appeared in the...

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Problems solved by technology

[0004] After searching the existing technology, it was found that the Chinese invention patent application "A preparation method for fine-grained diamond abrasive single-layer brazing tools" (CN 102513632 A) proposed a preparation method for fine-grained diamond abrasive tools. A diamond abrasive tool with uniform abrasive grain height and strong holding force can be produced, but the abrasive grain size used in this method is about 20-100 μm, and it is impossible to prepare a diamond abrasive tool with a lower particle size, and the preparation process includes two brazing steps, which is complicated and costly High, and high temperature brazing will cause diamond graphitization

The Chinese invention patent application "A method of manufacturing a brazed single-layer diamond grinding wheel" (CN 103786100 A) proposes a method for preparing a boron-doped diamond grinding wheel, and the boron-doped diamond grinding wheel prepared by this method improves the thermal stability of the diamond However, it is still unavoidable to avoid the disadvantages of large difference in thermal expansion coefficient between the bond and diamond abrasive grains, large brazing residual stress, and uneven thickness of the bond layer in the solder layer.

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