Preparation method of cationic ultraviolet light and heat dual deep curing adhesive

A deep curing, cationic technology, used in adhesives, non-polymer adhesive additives, epoxy resin adhesives, etc., can solve the problem that adhesives cannot achieve rapid and deep curing, and achieve short curing reaction time and volume shrinkage. Low, excellent adhesion and mechanical effects

Inactive Publication Date: 2017-07-07
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the existing UV-curable adhesives cannot achieve rapid deep-layer curing, and subsequent heating is still required after being irradiated with ultraviolet light, and to provide a method for preparing a cationic UV-light and heat dual deep-layer curing adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0028] Specific embodiment 1: This embodiment is a cationic ultraviolet light and heat dual deep-curing adhesive consisting of 60 to 100 parts of oligomeric resin mixture containing epoxy groups, 5 to 30 parts of diluent, It is prepared by 5-15 parts of coupling agent, 0.75-3 parts of photoinitiator, 0.75-3 parts of photosensitizer, 0.075-0.5 part of thermal initiator and 0-0.2 part of thermal stabilizer.

[0029] The advantage of this implementation mode:

[0030] 1. A cationic ultraviolet light and heat dual deep-curing adhesive prepared in this embodiment is cured by dual initiation means of ultraviolet light and heat. After being irradiated by ultraviolet light, it reacts rapidly, and at the same time, the heat generated by ultraviolet light is used to initiate a thermal curing reaction. process, so as to achieve rapid deep curing;

[0031] 2. A cationic ultraviolet light and heat double deep-curing adhesive prepared in this embodiment does not need post-heating to initia...

specific Embodiment approach 2

[0036] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the described oligomeric resin mixture containing epoxy groups is prepared according to the following steps:

[0037] Heat the resin containing bifunctional epoxy groups from room temperature to 60°C to 80°C at a stirring speed of 100r / min to 150r / min; Add oligomers containing multifunctional epoxy groups at 60°C to 80°C; then stir and react at a stirring speed of 150r / min to 200r / min and a temperature of 60°C to 80°C for 6h to 18h , to obtain an oligomeric resin mixture containing epoxy groups;

[0038] The mass ratio of the bifunctional epoxy group-containing resin to the polyfunctional epoxy group-containing oligomer is 100:(5-40). Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0039] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the resin containing difunctional epoxy groups is alicyclic epoxy resin, diester chain alicyclic epoxy Resin, aliphatic epoxy resin, bisphenol A epoxy resin and hydrogenated bisphenol A epoxy resin or a mixture of several thereof; the alicyclic epoxy resin is 3,4-epoxy ring Hexylmethyl 3,4-epoxycyclohexyl carboxylate; diester chain aliphatic epoxy bis((3,4-epoxycyclohexyl)methyl)adipate; aliphatic epoxy resin For ethylene glycol diglycidyl ether. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a preparation method of a cationic ultraviolet light and heat dual deep curing adhesive and relates to a preparation method of a curing adhesive. The method aims at solving the problems that an existing ultraviolet light curing adhesive cannot be rapidly cured deeply, and after ultraviolet light irradiation is used, following heating is still needed. The cationic ultraviolet light and heat dual deep curing adhesive is prepared from, by weight, 60-100 parts of oligomeric resin mixture, 5-30 parts of diluent, 5-15 parts of coupler, 0.75-3 parts of photoinitiator, 075-3 parts of photosensitizer, 0.075-0.5 part of thermal initiator and 0-0.2 part of heat stabilizer. The method includes the steps of 1, weighing; 2, mixing. The cationic ultraviolet light and heat dual deep curing adhesive is obtained. The cationic ultraviolet light and heat dual deep curing adhesive and the preparation method thereof can be obtained.

Description

technical field [0001] The present invention relates to a preparation method of a curing adhesive, which is a divisional application of "A Cationic Ultraviolet Light and Heat Dual Deep Curing Adhesive and Its Preparation Method" with an application date of October 26, 2015 and an application number of 201510702233.0. Background technique [0002] UV-curable adhesive is a kind of high-efficiency, environment-friendly and energy-saving adhesive. It not only has the advantages of no solvent and long storage time, but also has the advantages of fast curing speed and instant curing. However, because UV-curable adhesives rely on ultraviolet light to initiate curing, their curing depth is limited by ultraviolet radiation, and it is difficult to realize the application of colored systems. At the same time, it is difficult to realize the curing process in the shadow area of ​​the system. Subject to application limitations. [0003] The curing depth of UV-curable adhesives is affecte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06
CPCC08K2201/014C08L2205/025C09J11/06C09J163/00C08L63/00C08K5/5435C08K5/005C08K5/5425
Inventor 宋彩雨孙明明王磊赵明李坚辉薛刚刘彩召张绪刚李奇力梅格张斌
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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