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Sensor module packaging method

A packaging method and sensor module technology, applied in the field of sensor modules, can solve the problem of a large height error between a cover plate and a metal ring, and achieve the effects of good effect, reduced manufacturing difficulty, and reduced error

Active Publication Date: 2020-03-03
MICROARRAY MICROELECTRONICS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] That is to say, at this time, the packaging process of the mechanical structure is later than the packaging process of the electrical structure, which can reduce the manufacturing difficulty. However, the disadvantage is that the height error between the cover plate and the metal ring in the vertical direction is relatively large during installation.

Method used

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Embodiment Construction

[0068] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0069] In each drawing of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for convenience of illustration, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.

[0070] In addition, terms used herein such as "upper", "above", "under", "below", etc. to express relative positions in space are for convenience of description to describe a unit or feature as shown in the drawings relative to A relationship to another cell or feature. The terms of spatial relative position may be...

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Abstract

The invention discloses a sensing module packaging method, the sensing module packaging method includes the steps of: providing a response component; providing a metal ring, a step part is formed on the inner side of the metal ring, and the inner contour of the step part Enclosing an opening that can be penetrated by the response component; passing the response component through the opening, and the first part and the second part of the response component are respectively located on both sides of the opening; rotating the response The assembly reaches a predetermined position, and the first part is tilted so that the first part is carried on the step part. The sensor module packaging method according to an embodiment of the present invention can not only reduce the manufacturing difficulty, but also reduce the error in the vertical direction during installation, and the effect is better.

Description

technical field [0001] The invention relates to the technical field of sensor modules, in particular to a method for packaging a sensor module. Background technique [0002] At present, mobile phones use fingerprint recognition technology to achieve security, and the sensor modules currently on the market are roughly divided into two types, one is a circular structure, and the other is a non-circular structure. [0003] A typical ring-shaped structure such as the structure used by Apple mobile phones. [0004] Such as figure 1 As shown, it is a patent application of Apple Inc. (publication number US2016 / 0033342A1). [0005] The center of the mobile phone case 300 has a circular opening (not shown), which is used to accommodate the sensing module 200 and sense signals through the sensing module 200 located therein. [0006] The sensor module 200 includes a cover plate 201 , a metal ring 202 , a fingerprint sensor chip 203 , an elastic element 204 , electrodes 205 , wires 2...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
CPCG06V40/12
Inventor 李扬渊
Owner MICROARRAY MICROELECTRONICS CORP LTD
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