Heat-dissipating device

Abstract

The invention discloses a heat dissipation device. The heat dissipation device is installed in an electrical equipment for dissipating heat from a circuit board inside the electrical equipment. The heat sink is provided with a copper column for installation; a guide rail device for installing the heat sink, the guide rail device is arranged on the casing of the electrical equipment, the heat sink is arranged on the guide rail device, and is connected to the guide rail device The guide rail device forms a heat conduction path, and also includes an auxiliary installation column, the auxiliary installation column is arranged on the installation copper column, and there is an installation gap for clamping the circuit board between the auxiliary installation column and the installation copper column . The heat dissipation device provided by the invention can not only solve the problem of local heat generation of components but also dissipate heat from the whole machine, has high heat dissipation efficiency and good heat dissipation effect, and also has the functions of fixing and position limiting to improve assembly efficiency.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device for complete equipment. Background technique [0002] A large number of integrated circuits are used in the whole machine equipment. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system and shorten the service life, but may even cause some components to be burned, causing the integrated circuit system to fail to work normally. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or the integrated circuit internal. The purpose of installing the heat sink is to absorb the heat and then dissipate it inside or outside the case, so as to ensure the normal temperature of the computer components and the normal operation of the integrated circuit. [0003] In the prior art, heat sinks are mostly used for hea...

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Problems solved by technology

[0003] In the prior art, heat sinks are mostly used for heat dissipation of equipment, and the heat sinks are directly fixed on the heating components to increase the heat dissipation area and avoid the failure of integrated circuits caused by excessive local temperatures. However, in the prior art The added heat sink is mainly for local heat dissipation. The heat sink is not in contact with the shell. It is still ineffective for the temperature of the entire device to diss

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