The invention relates to an epoxy resin sealing material capable of resisting high temperature and high pressure and a method for preparing the same. The epoxy resin sealing material consists of an A component and a B component, wherein the A component comprises the epoxy resin formed by selecting one or more of bisphenol A type epoxy resin, AG-80 epoxy resin, hydantoin epoxy resin, p-aminophenol epoxy resin, bisphenol F epoxy resin, m-metaxylylenediamine epoxy resin, resorcin epoxy resin, bisphenol AD epoxy resin, bisphenol S epoxy resin, hydrogenation bisphenol A type epoxy resin, organic silicon modification bisphenol A type epoxy resin, fluorination epoxy resin and o-cresol-formaldehyde epoxy resin, and also comprises the components of a thinner, fillers and the like; and the B component is a curing agent. The epoxy resin sealing material can be used for encapsulation and packaging of various electric elements, and besides the functions of fixing, moisture prevention, anti corrosion, anti-counterfeiting and the like, the epoxy resin sealing material also has the function of bearing high pressure at a high temperature, so that the epoxy resin sealing material is widely used.