Preparation method of high-temperature-resistant pressure-sensitive adhesive tape

A pressure-sensitive adhesive tape, high-temperature-resistant technology, applied in pressure-sensitive films/sheets, adhesives, film/sheet-shaped adhesives, etc., can solve problems such as foaming, degumming, and poor high-temperature stability of acrylate pressure-sensitive adhesives. Achieve good pressure sensitivity, fast speed and low reaction temperature

Inactive Publication Date: 2020-06-05
东莞爵士先进电子应用材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, acrylate pressure-sensitive adhesives generally have poor high-temperature stability, and it is difficult to bond low-energy surface materials, and it is easy to cause degumming in a high-temperature environment exceeding 150 °C.
In view of these problems, the patent CN107236490A discloses a preparation method of high-temperature resistant pressure-sensitive adhesive. Firstly, the silica gel rich in silanol is obtained by hydrochloric acid decomposition, and then the zeolite is treated with silicate to make the surface of the zeolite bear silanol. Then use concentrated sulfuric acid as a catalyst to dehydrate and condense the silica gel and the silanol on the surface of the zeolite to form a Si-O-Si bond with a lar

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A preparation method of high temperature resistant pressure sensitive adhesive tape, comprising the following steps:

[0028] Step A: Preparation of High Temperature Resistant Acrylic Pressure Sensitive Adhesive

[0029] 1.1 Stir 65 parts of ethyl acrylate, 35 parts of vinyl acetate, 10 parts of methyl methacrylate, 1 part of acrylic acid, and 1 part of hydroxypropyl acrylate in a stirring tank to obtain a monomer mixture;

[0030] 1.2 Add 100 parts of ethyl acetate, 0.1 part of azobisisobutyronitrile, and 30 parts of the monomer mixture obtained in step 1.1 into the reactor together, start feeding nitrogen to discharge the oxygen in the reactor, and keep The pressure is at 0.1Mpa; continue to feed nitrogen, raise the temperature of the reactor to 75°C, and stir at a constant speed and constant temperature for 60 minutes while refluxing;

[0031] 1.3 Add the remaining 82 parts of the monomer mixture and 0.05 parts of azobisisobutyronitrile into the reactor dropwise, an...

Embodiment 2

[0038] A preparation method of high temperature resistant pressure sensitive adhesive tape, comprising the following steps:

[0039] Step A: Preparation of High Temperature Resistant Acrylic Pressure Sensitive Adhesive

[0040] 1.1 Stir 80 parts of ethyl acrylate, 25 parts of vinyl acetate, 20 parts of methyl methacrylate, 3 parts of acrylic acid, and 3 parts of hydroxypropyl acrylate in a stirring tank to obtain a monomer mixture;

[0041] 1.2 Add 120 parts of ethyl acetate, 0.3 parts of azobisisobutyronitrile, and 40 parts of the monomer mixture obtained in step 1.1 into the reactor together, and start to pass nitrogen gas to discharge the oxygen in the reactor for 15- After 30 minutes, keep the pressure at 0.2Mpa; continue to feed nitrogen, raise the temperature of the reactor to 80°C, and stir at a constant speed and constant temperature for 50 minutes while refluxing;

[0042] 1.3 Add the remaining 91 parts of the monomer mixture and 0.15 parts of azobisisobutyronitrile to...

Embodiment 3

[0049] A preparation method of high temperature resistant pressure sensitive adhesive tape, comprising the following steps:

[0050] Step A: Preparation of High Temperature Resistant Acrylic Pressure Sensitive Adhesive

[0051] 1.1 Stir 90 parts of ethyl acrylate, 10 parts of vinyl acetate, 10 parts of methyl methacrylate, 5 parts of acrylic acid, and 5 parts of hydroxypropyl acrylate in a stirring tank to obtain a monomer mixture;

[0052] 1.2 Add 160 parts of ethyl acetate, 0.6 part of azobisisobutyronitrile, and 45 parts of the monomer mixture obtained in step 1.1 into the reactor together, start feeding nitrogen to discharge the oxygen in the reactor, and keep The pressure is at 0.3Mpa; continue to feed nitrogen, raise the temperature of the reactor to 85°C, and stir at a constant speed and constant temperature for 30 minutes while refluxing;

[0053] 1.3 Add the remaining 75 parts of the monomer mixture and 0.3 parts of azobisisobutyronitrile into the reaction kettle dro...

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Abstract

The invention discloses a preparation method of a high-temperature-resistant pressure-sensitive adhesive tape. The preparation method comprises the following three steps: preparation of a high-temperature-resistant acrylate pressure-sensitive glue, modification of a solvent type pressure-sensitive glue and preparation of the high-temperature-resistant pressure-sensitive adhesive tape. The high-temperature-resistant pressure-sensitive adhesive tape prepared by the invention has excellent high-temperature resistance; after baking at 240 DEG C for 30 minutes, excellent pressure ensitivity is maintained, no apperance bubbling or server yellowing is caused;the prepared high-temperature-resistant pressure-sensitive adhesive tape can be used for SMT (Surface Mount Technology) in the production process of FPCs (Flexible Printed Circuit Boards) and PCBs (Printed Circuit Boards), can resisthigh temperature of wave soldering and reflow soldering, and has the effects of high-temperature shieldingand part fixing.

Description

technical field [0001] The invention belongs to the technical field of adhesive preparation, and in particular relates to a preparation method of high-temperature-resistant pressure-sensitive adhesive tape. Background technique [0002] The full name of pressure-sensitive adhesive is pressure-sensitive adhesive, which is a kind of pressure-sensitive adhesive, referred to as pressure-sensitive adhesive. It is one of the most widely used and most produced adhesive varieties at present, and it is inseparable from people's daily life. It can stick to other surfaces by applying appropriate pressure during use. Due to its special adhesive properties, it can form a firm bond without heating or solvent under the action of small pressure. The pressure-sensitive adhesive and the surface of the adherend mainly rely on van der Waals force for bonding, so it has several obvious advantages: (1) the bonding process is easy; (2) it is easy to peel off; (3) peeling will not damage the bond ...

Claims

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Application Information

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IPC IPC(8): C09J7/38C09J7/21C09J133/08C09J11/06C08F220/18C08F218/08C08F220/14C08F220/06C08F220/20
CPCC08F220/18C09J11/06C09J133/066C09J2203/326C09J2400/263C09J2433/00C09J7/21C09J7/385
Inventor 纪生张英润周胜吉林建均
Owner 东莞爵士先进电子应用材料有限公司
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