Epoxy resin sealing material and method for preparing same

A technology of epoxy resin and potting compound, applied in chemical instruments and methods, other chemical processes, etc., to improve heat resistance and hardness, and overcome low temperature resistance

Inactive Publication Date: 2012-12-26
ZHONGHAO CHENGUANG RES INST OF CHEMICALINDUSTRY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing epoxy resin potting compound is difficult to meet the above requirements at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] To prepare the A component of epoxy resin potting compound, take the following components (all in kilograms):

[0032] Epoxy resin E-51 100

[0033] Phenyl glycidyl ether 12

[0034] Fumed white carbon black 2

[0035] Modified ultrafine barium sulfate 25

[0036] Silica powder 20

[0037] Titanium dioxide 20

[0038] Methyl silicone oil 2

[0039] Measure into the mixing container according to the above formula sequence, stir evenly, and grind 2 times on a three-roll mill.

[0040] Epoxy resin potting compound A component: choose metaxylylenediamine curing agent.

[0041] The use ratio of components A and B is A:B=100:12; first mix uniformly, then potting and curing at room temperature.

[0042] Effect: The cured product can withstand 225 kg of pressure within 350 seconds at 165°C, and the rejection rate is less than 5%.

Embodiment 2

[0044] To prepare the A component of epoxy resin potting compound, take the following components (all in kilograms):

[0045] Epoxy resin E-51 50

[0046] Metaxylylenediamine epoxy resin 50

[0047] Phenyl glycidyl ether 30

[0048] Modified ultrafine barium sulfate 25

[0049] Silica powder 40

[0050] Titanium dioxide 40

[0051] Methyl silicone oil 1

[0052] Measure into the mixing container according to the above formula sequence, stir evenly, and grind 2 times on a three-roll mill.

[0053] Epoxy resin potting compound A component: choose metaxylylenediamine curing agent.

[0054] The use ratio of components A and B is A:B=100:13; first mix well, then potting, first curing at room temperature, and then strengthening curing at 100°C for 1 hour.

[0055] Effect: The cured product can withstand 225 kg of pressure within 350 seconds at 165°C, and the rejection rate is less than 5%.

Embodiment 3

[0057] To prepare the A component of epoxy resin potting compound, take the following components (all in kilograms):

[0058] Metaxylylenediamine epoxy resin 100

[0059] Phenyl glycidyl ether 50

[0060] Fumed white carbon black 3

[0061] Modified ultrafine barium sulfate 50

[0062] Silica powder 50

[0063] Titanium dioxide 60

[0064] Methyl silicone oil 3

[0065] Measure into the mixing container according to the above formula sequence, stir evenly, and grind 2 times on a three-roll mill.

[0066] Epoxy resin potting compound A component: choose metaxylylenediamine curing agent.

[0067] The use ratio of components A and B is A:B=100:13; first mix well, then potting, first curing at room temperature, and then strengthening curing at 100°C for 1 hour.

[0068] Effect: The cured product can withstand 230 kg of pressure within 360 seconds at 170°C, and the reject rate is less than 5%.

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PUM

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Abstract

The invention relates to an epoxy resin sealing material capable of resisting high temperature and high pressure and a method for preparing the same. The epoxy resin sealing material consists of an A component and a B component, wherein the A component comprises the epoxy resin formed by selecting one or more of bisphenol A type epoxy resin, AG-80 epoxy resin, hydantoin epoxy resin, p-aminophenol epoxy resin, bisphenol F epoxy resin, m-metaxylylenediamine epoxy resin, resorcin epoxy resin, bisphenol AD epoxy resin, bisphenol S epoxy resin, hydrogenation bisphenol A type epoxy resin, organic silicon modification bisphenol A type epoxy resin, fluorination epoxy resin and o-cresol-formaldehyde epoxy resin, and also comprises the components of a thinner, fillers and the like; and the B component is a curing agent. The epoxy resin sealing material can be used for encapsulation and packaging of various electric elements, and besides the functions of fixing, moisture prevention, anti corrosion, anti-counterfeiting and the like, the epoxy resin sealing material also has the function of bearing high pressure at a high temperature, so that the epoxy resin sealing material is widely used.

Description

Technical field [0001] The invention relates to a potting material, in particular to a high temperature resistant epoxy resin potting material and a preparation method thereof. Background technique [0002] Epoxy resin has excellent dielectric properties, mechanical properties and adhesion properties, its curing shrinkage is small, the linear expansion coefficient is small, the dimensional stability is good, and the operation process performance is good, so it is widely used in various fields. [0003] With the continuous development of electronic technology, epoxy resin has become one of the important pillars of the electronics industry. The material with epoxy resin as the main body is widely used in the bonding, potting and encapsulation of electronic components, and plays an important role in the fixing, moisture-proof, anti-corrosion and anti-counterfeiting of electronic components. However, due to the further development of electronic technology, its packaging requirements a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C08G59/20C08K3/36C08K3/34C08K7/14C08K3/30C08K3/26C08K3/22C08L63/02C08L63/00C09K3/10
Inventor 谭周琴张杰
Owner ZHONGHAO CHENGUANG RES INST OF CHEMICALINDUSTRY CO LTD
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