The invention relates to the technical field of power device packaging, in particular to a low-thermal-expansion high-temperature-resistant
epoxy resin composition and a preparation method thereof.The low-thermal-expansion high-temperature-resistant
epoxy resin composition is prepared from, by weight, 12-25% of
epoxy resin, 5-10% of curing agent, 0.5-5% of
diluent, 0.1-0.5% of
coupling agent and 75-90% of modified
silicon dioxide, the
organic solvent is any one of 2, 2-bis (4-hydroxyphenyl)
propane, 4, 4 '-dihydroxydiphenylmethane, 4, 4'-dihydroxydiphenyl
sulfone, 2, 2-bis (3, 5-dibromo-4-hydroxyphenyl)
propane, 2, 2-bis (4-hydroxycyclohexyl)
propane, 4, 4 '-dihydroxybiphenyl, 4, 4'-dihydroxydiphenyl
ether, p-aminophenol, m-aminophenol, 4-hydroxyaniline and 3, 4-epoxy cyclohexylmethanol. The low-thermal-expansion and high-temperature-resistant epoxy resin composition disclosed by the invention has relatively low
thermal expansion coefficient, relatively high glass-
transition temperature and relatively high mechanical properties, meets the high-temperature service requirements of power devices, and is particularly suitable for scenes with requirements on high strength, high
toughness and high stability.