Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Methods of locating parts on board in desired orientation and position, pick and place machines and sensors

A sensor, pick-and-place machine technology, applied in the field of nozzle pick-up parts, pick-and-place machines and sensors for such pick-and-place machines, which can solve problems such as impracticality and limited memory

Active Publication Date: 2021-06-08
ASSEMBLEON NV
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is not practical to store the information about the angular position of the nozzle from the actuator and the information from the sensor for later analysis because the memory within the sensor is limited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods of locating parts on board in desired orientation and position, pick and place machines and sensors
  • Methods of locating parts on board in desired orientation and position, pick and place machines and sensors
  • Methods of locating parts on board in desired orientation and position, pick and place machines and sensors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The term "part" is used herein to refer to a broad category of parts that can be "picked" and "placed" using a pick-and-place machine. Example components include semiconductor dies, capacitors, resistors, integrated circuits, packaged devices, and the like.

[0029] The term "board" as used herein refers to a broad class of substrates onto which components may be placed using a pick and place machine. Example boards (also referred to as substrates) include printed circuit boards, lead frames, wafers, glass substrates, metal plates, and the like.

[0030] The invention relates to a method of positioning a component at a desired position on a board, whereby said component is picked up by means of a nozzle of a movable placement unit of a pick-and-place machine. The placement unit includes sensors. After determining the orientation of the part relative to the nozzle, the part is placed in the desired position on the plate with the correct orientation. The invention also...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Methods are provided for positioning components at desired locations on the board. The method comprises the steps of: (a) picking up a part with a nozzle of a movable placement unit of a pick-and-place machine; (b) conveying said part toward a plate according to a desired position; sensor data on the orientation of the nozzle; (d) acquire sensor rotation data on the orientation of the nozzle relative to the placement unit; (e) combine the sensor data and rotation data into a data set within the sensor; (f) send the data set from the sensor to a stationary computer and calculating correction instructions within the stationary computer; and (g) placing said components on the board according to the correction instructions from the stationary computer.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Application No. 62 / 268578, filed December 17, 2015, the contents of which are hereby incorporated by reference. technical field [0003] The invention relates to a method of positioning a component at a desired position on a board, whereby the component is picked up by a nozzle of a movable placement unit of a pick and place machine. The invention also relates to a pick and place machine and a sensor for such a pick and place machine. Background technique [0004] Using a pick-and-place machine, parts can be rotated with the nozzle (about the nozzle's axis of rotation) in the φ direction and in the direction opposite to the φ direction, and can be rotated with the nozzle in (i) an XY plane extending perpendicular to the axis of rotation and ( ii) Movement in the Z direction extending parallel to the axis of rotation. [0005] Several methods are known to determine th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B25J9/16B25J15/06G01B11/00
CPCB25J9/1633B25J15/065G01B11/00H05K13/0813H05K13/0413G05B2219/49314G05B2219/49363H05K13/0408
Inventor J·L·霍里约恩
Owner ASSEMBLEON NV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products