Methods of locating parts on board in desired orientation and position, pick and place machines and sensors
A sensor, pick-and-place machine technology, applied in the field of nozzle pick-up parts, pick-and-place machines and sensors for such pick-and-place machines, which can solve problems such as impracticality and limited memory
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[0028] The term "part" is used herein to refer to a broad category of parts that can be "picked" and "placed" using a pick-and-place machine. Example components include semiconductor dies, capacitors, resistors, integrated circuits, packaged devices, and the like.
[0029] The term "board" as used herein refers to a broad class of substrates onto which components may be placed using a pick and place machine. Example boards (also referred to as substrates) include printed circuit boards, lead frames, wafers, glass substrates, metal plates, and the like.
[0030] The invention relates to a method of positioning a component at a desired position on a board, whereby said component is picked up by means of a nozzle of a movable placement unit of a pick-and-place machine. The placement unit includes sensors. After determining the orientation of the part relative to the nozzle, the part is placed in the desired position on the plate with the correct orientation. The invention also...
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