Rotating device

Abstract

The present invention provides a rotating device comprising: a holding mechanism for holding three holding claws (311) in contact with the outer circumference of the wafer and holding the wafer; a spin rotation mechanism (4) having a holding mechanism (3) and a judging unit (5) for judging whether or not the center of the wafer coincides with the axis of the rotary shaft, and the holding mechanism has output portions (36a to 36c) which are arranged in accordance with the rotation of the shaft (40a) (50a to 50c) for determining the position of the wafer held by the three holding claws from the center of the wafer and the axis of rotation of the rotation axis, and the judgment unit includes: storage units (50a to 50c) (50a to 50c) of the three holding claws stored in the storage unit according to whether or not the respective output values of the rotation of the rotation axis at a predetermined angle are coincident with the output values (50a to 50c) of the three holding claws stored in the storage unit Determine the offset of the wafer.

Description

technical field [0001] The present invention relates to a spinner for washing and drying a wafer by rotating it while holding the wafer. Background technique [0002] In the semiconductor manufacturing process, among cleaning units that clean wafers, there is a single spin type cleaning unit that processes wafers one by one, for example. In this cleaning unit, for example, there is a rotation device that clamps and holds the outer periphery of the wafer with a plurality of holding claws, and makes the sandwiched portion revolve around the spin rotation axis, thereby making the The wafer is rotated and cleaned / dried (for example, refer to Patent Documents 1 and 2). In this rotary device, the holding claws holding the outer periphery of the wafer are rotated to open, and the wafer conveyed above the rotary table is clamped and held. [0003] That is, in the rotation device in the above-mentioned example, there are at least three holding claws connected to the rotating shafts...

AI Technical Summary

Problems solved by technology

[0009] However, it is difficult to accurately arrange 3 holding claws, 3 protrusions, and 3 sensors at equal intervals

Furthermore, when the wafer is transported over the rotary table and clamped and held by the holding claws, it is difficult to accurately align the center of the wafer with the axis of the spin rotation axis to transport and position the wafer above the rotary table. , there is a case where the center of the wafer held by the holding claw is shifted from the axis center of the spin rotation axis

In this state, when the wafer spins, since the centrifugal force generated by the spin rotation is not evenly distributed on the holding claws, sometimes the holding claws cannot maintain the holding of the wafer, and the wafer may be blown away. fall

[0010] Therefore, in the spinner, when the wafer is held by the holding claws in a state where the center of the wafer is shifted from the axis of the spin rotation axis, the problem of recognizing the shift of the center of the wafer arises.

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