Camera module manufacturing method and camera module manufacturing apparatus
A technology of camera module and manufacturing method, which is applied to the camera body, camera, installation, etc., can solve the problems of resolution reduction, yield reduction, etc., and achieve the effect of resolution reduction
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Embodiment approach 1
[0040] figure 1 (a) to (d) are schematic diagrams showing an example of the method of manufacturing the camera module according to the first embodiment. like figure 1 As shown in (a) to (d), the camera module 100 includes: an actuator block 21 that displaces and drives the optical lens 28 in the direction of the optical axis by making the lens fixing member 29 that accommodates the optical lens 28 movable; and An imaging block configured by mounting an imaging element 23 on a substrate 22 . The actuator block 21 is connected to the imaging block with an adhesive 25 on the platform 24 .
[0041] Specifically, the imaging block has a structure in which the imaging element 23 is mounted in a state where the imaging surface faces the mounting surface 22 c of the substrate 22 . More specifically, as a plan view with the actuator block 21 removed figure 1 As shown in (c), it is mounted by performing flip-chip bonding between the terminal portion 23 a of the imaging element 23 an...
Embodiment approach 2
[0053] Image 6 (a) and (b) are figures which show an example of the manufacturing method of the camera module of Embodiment 2. FIG. The camera module 100A of Embodiment 2 differs from the camera module 100 of Embodiment 1 in that the substrate 22 is changed to a substrate 22A, and the platform 24 is changed to a platform 24A. Other than these, since it is the same as Embodiment 1, description is not repeated here.
[0054] like Image 6 As shown in (a) and (b), the imaging block is configured by mounting the imaging element 23 on the substrate 22 . Specifically, the imaging element 23 is mounted on the substrate 22A such that the surface of the imaging element 23 opposite to the imaging surface faces the rear surface 22 a. In addition, as in the first embodiment, the imaging device 23 is mounted by flip-chip bonding between the terminal portion 23 a and the substrate 22A.
[0055] The substrate 22A of the second embodiment is provided with three through holes 22d, which i...
Embodiment approach 3
[0058] In Embodiments 1 and 2, the actuator block 21 is set on the imaging block in parallel to the flat surface 27a of the pedestal part 27 using the actuator block loading head 32, so that the central axis of the optical lens 28 26 is perpendicular to the imaging plane of the imaging device 23 , and more preferably, the contact surface 20 of the actuator block 21 that contacts the actuator block loading head 32 is stored perpendicular to the central axis 26 of the optical lens 28 . The structure of the actuator block 21 for realizing such a configuration will be described in detail below.
[0059] Figure 7 It is a figure which shows the detailed structure of an actuator block. like Figure 7 As shown, the optical part 52 of the camera module 100 includes one or more optical lenses 28 and a lens barrel 51 supporting the optical lenses 28 . Furthermore, a lens driving device 54 is provided around the optical portion 52 . The lens driving device 54 includes a lens holder 5...
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