Method and device for making flexible screen and fingerprint module fit each other

A fingerprint module and flexible screen technology, which is applied in the direction of acquiring/arranging fingerprints/palmprints, character and pattern recognition, and instruments. To achieve the effect of bonding

Inactive Publication Date: 2017-08-25
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional fingerprint module bonding scheme is not suitable for bonding fingerprint modules on flexible screens

Method used

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  • Method and device for making flexible screen and fingerprint module fit each other
  • Method and device for making flexible screen and fingerprint module fit each other
  • Method and device for making flexible screen and fingerprint module fit each other

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Embodiment Construction

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.

[0022] Before discussing the exemplary embodiments in greater detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowchart depicts the steps as a sequential process, many of the steps may be performed in parallel, concurrently, or concurrently. Furthermore, the order of the steps can be rearranged. The process may be terminated when its operation is complete, but may also have additional steps not included in the figures. The processes may cor...

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PUM

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Abstract

The embodiments of the invention disclose a method and a device for making a flexible screen and a fingerprint module fit each other. The method comprises the following steps: when fixing a flexible screen on a workbench, measuring a first height of the upper surface of a preset fingerprint module area of the flexible screen relative to a reference plane; in the process of making the fingerprint module move to the fingerprint module area, measuring a second height of the lower surface of the fingerprint module relative to the reference plane; determining the height difference between the lower surface of the fingerprint module and the upper surface of the fingerprint module area according to the first height and the second height; and if the fingerprint module is suspended right above the fingerprint module area, adjusting the height difference to make the fingerprint module contact and compress a liquid glue layer on the upper surface of the fingerprint module area until the height difference is within a set threshold interval. According to the embodiments, the difference between the opposite surfaces of the fingerprint module and the fingerprint module area on the flexible screen is controlled precisely, and adhesion between the fingerprint module and the flexible screen is realized.

Description

technical field [0001] The embodiments of the present invention relate to fingerprint identification technology, and in particular, to a method and device for realizing the bonding of a flexible screen and a fingerprint module. Background technique [0002] At present, in the field of smart terminals, especially touch display devices, due to the advantages of high uniqueness, high stability, high accuracy, high security, high collectability and low cost of fingerprint recognition, fingerprint recognition is used in touch. The control display device changes from "optional" to "standard". [0003] At present, the more popular capacitive fingerprint recognition modules on the market can be roughly divided into two categories: hidden and non-hidden. IFS (Invisible Fingerprint Sensor, hidden fingerprint sensor) is different from the traditional modular fingerprint sensor. , there is no need to open a hole on the front panel or the rear case to put the fingerprint module, but pla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06F1/16
CPCG06F1/1652G06V40/1306
Inventor 张文真
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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