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Assembling method of camera module, camera module, and mobile terminal

A technology of camera module and assembly method, which is applied in the directions of image communication, radiation control devices, color TV parts, etc., can solve the problems of glue overflow, poor camera module products, unreliable bonding, etc., and improve the firmness of assembly sexual effect

Inactive Publication Date: 2017-08-25
MEIZU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the bottom end of the bracket is fixed to the circuit board, there will be unreliable bonding or overflow of glue, resulting in defective camera module products

Method used

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  • Assembling method of camera module, camera module, and mobile terminal
  • Assembling method of camera module, camera module, and mobile terminal
  • Assembling method of camera module, camera module, and mobile terminal

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0027] It should be noted that, in the present invention, when a component is considered to be "connected" to another component, it may be directly connected to another component, or may be indirectly connected to another component through an intermediate component.

[0028] Unless otherwise defined, all technical and scientific terms used her...

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PUM

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Abstract

The invention provides an assembling method of a camera module, a camera module, and a mobile terminal. The camera module comprises a circuit board, an electronic device, a photosensitive element, a plurality of metal wires and a bracket. The electronic device and the photosensitive element are fixedly arranged on the circuit board; and, both ends of each metal wire are electronically connected with the photosensitive element and the circuit board separately. The assembling method comprises the following steps: adhering and fixing each metal wire between the photosensitive element and the circuit board; placing the circuit board adhered with the metal wires in an injection mold; injecting the injection molding material in a cavity of the injection mold; covering partial area of the circuit board by the injection molding material to form the bracket. The bracket and the circuit board are integrated, so that the assembling fastness of the camera module is improved.

Description

technical field [0001] The invention relates to the technical field of camera modules, in particular to an assembly method of a camera module by injection molding, a camera module and a mobile terminal. Background technique [0002] This section is intended to provide a background or context to a detailed description of the invention that is recited in the claims. The descriptions herein are not admitted to be prior art by inclusion in this section. [0003] In recent years, camera modules have been widely used in electronic products such as mobile phones, tablet computers, and notebook computers. At present, the production process of camera module bracket assembly is as follows: firstly, glue is drawn on the designated area by the machine on the semi-finished product containing electronic components, circuit boards, photosensitive elements and gold wires, and then the existing bracket is glued on, and finally through baking Baking cured glue. [0004] However, when the b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H01L27/146
CPCH01L27/14601H01L27/1469H04N23/50H04N23/57H04N23/54
Inventor 谢高卫王文熹
Owner MEIZU TECH CO LTD
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