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Chip bonding equipment and method

A chip bonding and chip technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of batch bonding and low transmission efficiency.

Active Publication Date: 2019-10-25
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a chip bonding equipment and method to solve the problems in the prior art that the chip bonding equipment has low pick-up and transfer efficiency and cannot bond in batches

Method used

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  • Chip bonding equipment and method
  • Chip bonding equipment and method
  • Chip bonding equipment and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] This embodiment proposes a device and method for dual-stage cyclic batch bonding of circular loop transfer chips. Specifically, a circular loop picks up and transfers chips and dual-bonding stations cyclic batch bonding to realize cyclic batch bonding. It can effectively increase the productivity.

[0058] Such as Figure 1 to Figure 3 As shown, the chip bonding equipment provided in this embodiment includes: a feeding area, a separation and alignment area, a bonding area and a discharging area arranged in sequence.

[0059] The feeding area is arranged on the left side of the chip separation work table 1 in the separation and alignment area, and includes: a feeding chip warehouse 8 and a feeding robot 9 for picking and placing blue diaphragms carrying chips 130 .

[0060] The separation and alignment area is used to separate and pick up the chip 130 on the blue diaphragm, measure and adjust the rotation of the chip 130, judge the chip waste and collect it, which inclu...

Embodiment 2

[0078] The difference between this embodiment and Embodiment 1 is that this embodiment is aimed at the fast bonding process, and the circular track 3 is used to quickly transfer the chip 130 to ensure the transfer effect. After the No. 1 bonding station 6 is bonded, two bonds The bonding station is transposed, the No. 2 bonding station 7 continues to bond, and the No. 1 bonding station 6 performs subsequent processes or replaces a new substrate 110 . In other words, the bonding in this embodiment is performed directly after the single chip 130 is handed over, until the substrate 110 is bonded and the bonding station is replaced. The new bonding station continues to bond, and the bonded bonding station continues to perform subsequent operations without affecting the transfer of the chip 130 and the continuation of the bonding process.

[0079] Specifically, please refer to Figure 5 , the chip bonding method of the present embodiment includes:

[0080] Step 10: Loading the ch...

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PUM

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Abstract

The invention discloses a chip bonding device and method. The chip bonding device comprises a feeding area, a separation alignment area, a bonding area and a discharging area, wherein the feeding area is used for picking and placing a blue diaphragm bearing a chip; the separation alignment area is used for separating and picking up the chip on the blue diaphragm; the bonding area comprises a bonding table I and a bonding table II, and the bonding table I and the bonding table II receive a chip from the separation alignment area alternatively and perform bonding; and the discharging area is used for picking and placing a substrate for bonding. The chip bonding device performs measurement and adjustment through setting the separation alignment area, scrap chips are judged and collected, and the bonding table I and the bonding table II are utilized to operate alternatively at the same time, so that a problem that the existing bonding device is low in pickup and transmission efficiency and incapable of performing batch bonding.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a chip bonding device and method. Background technique [0002] Chip bonding is a key process step in the packaging process of semiconductor devices. Typical bonding technologies are divided into tape automated bonding (TAB), wire bonding (WB) and flip chip bonding (FCB). Among them, the wire bonding technology is divided into: thermocompression bonding, ultrasonic bonding and thermosonic bonding. At present, the chip bonding equipment mostly adopts the method of single-chip bonding, that is, the chip is picked up by the chip pick-up mechanism and transferred to the bonding table for bonding. The bonding speed of the flip-chip bonding technology is fast, but it is prone to the phenomenon of waiting for the chip to be transferred; while the bonding speed of the wire bonding technology is relatively slow, and it is prone to the phenomenon of transferring and waiting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/60
CPCH01L21/67121H01L24/80H01L2224/80
Inventor 王冲冲唐彩红
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD