A method of manufacturing a printed circuit board and a printed circuit board
A printed circuit board and manufacturing method technology, applied in the field of technology, can solve the problems of poor heat dissipation performance of the PCB board, and achieve the effect of satisfying the heat dissipation effect and solving the single structure.
Active Publication Date: 2019-12-17
VIVO MOBILE COMM CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for making a printed circuit board and a printed circuit board, so as to solve the problem of poor heat dissipation of the PCB board in the prior art
Method used
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specific example
[0080] In the embodiment of the present invention, two specific examples are provided for the setting of the inner layer network, as follows:
[0081] The first type, such as Figure 4 As shown, the intermediate plate 1 is provided with a second through hole 8, and the second through hole 8 runs through the metal substrate 2, the insulating medium layer 6 and the metal layer 7;
[0082] The inside of the second through hole 8 (which can also be understood as the inner wall of the second through hole 8 ) is provided with an electroplating material 9 , which communicates with the metal layer 7 ;
[0083] An insulating material 10 is provided between the electroplating material in the second through hole 8 (which can also be understood as the outer wall of the second through hole 8 ) and the metal substrate 2 to form an inner layer network.
[0084] This structure has simple process and good heat dissipation effect.
[0085] The second type, such as Figure 5 As shown, the mid...
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The invention provides a fabrication method of a printed circuit board and the printed circuit board. The fabrication method of the printed circuit board comprises the steps of fabricating a first intermediate plate; drilling at a first preset position on the first intermediate plate until a metal substrate in the first intermediate plate is exposed to obtain a heat conduction hole; performing electroplating and hole filling on the heat conduction hole in the first intermediate plate to obtain a second intermediate plate; and performing first pattern transferring and etching on the second intermediate plate to form an outer-layer network so as to obtain the printed circuit board. By the scheme, a metal-based heat-dissipation PCB can be produced, the demand of good heat dissipation effect can be satisfied, the problem of single structure of a metal-base heat-dissipation plate can be solved, and the function of installing a plurality of components on the PCB is achieved.
Description
technical field [0001] The invention relates to the technical field of technology, in particular to a method for manufacturing a printed circuit board and the printed circuit board. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) board is the support body of electronic components. Electronic components will generate heat during the working process. The existing PCB board mainly dissipates heat through the bottom heat dissipation layer. This heat dissipation layer is often made of aluminum plates, ceramics and other materials, but the heat generated by components is difficult to be exported horizontally in time, resulting in heat dissipation. The temperature of the layer is high, and the heat of the components cannot be dissipated well. For high-end high-power or multiple high-power components, the heat dissipation requirements cannot be met. [0003] In addition, the heat dissipation layer of the existing metal substrate is located on one si...
Claims
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IPC IPC(8): H05K1/02H05K3/00H05K3/42
CPCH05K1/0206H05K3/0047H05K3/0094H05K3/42H05K2203/0214
Inventor 吴会兰吴爽孙学彪李明
Owner VIVO MOBILE COMM CO LTD