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Surge protection device and method, and a mobile terminal

A surge protection and mobile terminal technology, applied in the electronic field, can solve the problems of increasing the difficulty and cost of chip manufacturing, increasing the volume of the diode chip, and increasing the burden on the circuit board, so as to reduce the difficulty and cost of manufacturing, reduce the burden on space, The effect of increasing the effect

Active Publication Date: 2019-11-08
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the TVS diode is used alone to protect electronic equipment, the requirements for the diode chip will be relatively high, not only requiring it to have a higher reverse withstand voltage capability, but also requiring it to have a lower clamping voltage capability, so This increases the difficulty and cost of making the chip, and at the same time leads to an increase in the size of the diode chip, which increases the burden on the internal circuit board of the electronic device.

Method used

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  • Surge protection device and method, and a mobile terminal
  • Surge protection device and method, and a mobile terminal

Examples

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Embodiment Construction

[0024] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0025] figure 1 is a schematic block diagram of a surge protection device 100 shown according to an exemplary embodiment, as figure 1 As shown, the device 100 includes a transient suppression diode 10 and an overvoltage protection chip 20, wherein one end of the transient suppression diode 10 is connected to the interface 1 between the overvoltage protection chip 20 and the interface ...

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Abstract

The invention discloses a surge protection device and method and a mobile terminal, and relates to the field of the electronics. The device comprises a transient voltage suppression diode and an overvoltage protection chip, wherein one end of the transient voltage suppression diode is connected with a common port of the overvoltage protection chip and an interface needing the surge protection, and the other end of the transient voltage suppression diode is grounded; the other end of the overvoltage protection chip is connected with a chip needing the surge protection. The transient voltage suppression diode and the overvoltage protection chip are used for performing dual protection on the possible surge, the high-protection capability requirement on the transient voltage suppression diode is lowered, the manufacturing difficulty and cost of the transient voltage suppression diode is lowered, so that the volume of the transient voltage suppression diode is reduced, the space burden of the a circuit board of the chip needing the surge protection is relieved, and the surge protection effect is improved.

Description

technical field [0001] The present disclosure relates to the field of electronics, and in particular to a surge protection device and method and a mobile terminal. Background technique [0002] In the related art, in order to prevent damage to the electronic equipment caused by the surge that may occur when the electronic equipment is being charged, a TVS diode is usually connected to the charging interface of the electronic equipment. Due to the high-voltage conduction performance of the TVS diode, When a surge occurs, the surge voltage can be reduced to protect electronic equipment. However, if the TVS diode is used alone to protect electronic equipment, the requirements for the diode chip will be relatively high, not only requiring it to have a higher reverse withstand voltage capability, but also requiring it to have a lower clamping voltage capability, so This increases the difficulty and cost of making the chip, and at the same time increases the volume of the diode c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02H9/04H02H3/20
CPCH02H3/20H02H9/045
Inventor 赵青晖
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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