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Adhesive composition and bonded structure

A composition and adhesive technology, which is applied in adhesives, conductive adhesives, non-polymer adhesive additives, etc., can solve the problems of difficult storage stability and low activation energy, and achieve improved storage stability, The effect of excellent balance and excellent storage stability

Active Publication Date: 2019-08-16
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to cure the above-mentioned adhesive at low temperature, it is necessary to use a thermal latent catalyst with low activation energy, but it is difficult to make it stable in storage

Method used

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  • Adhesive composition and bonded structure
  • Adhesive composition and bonded structure
  • Adhesive composition and bonded structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～4

[0244] (Production of adhesive for circuit connection)

[0245] In terms of solid mass ratio, thermoplastic resin, radical polymerizable compound and radical polymerization initiator, and boron-containing complex or amine compound are blended as shown in Table 1, and the adhesive component (adhesive for circuit connection 1.5% by volume of conductive particles was blended and dispersed based on the total volume of components other than the conductive particles to obtain an adhesive for circuit connection. The obtained adhesive for circuit connection was coated on a fluororesin film with a thickness of 80 μm using a coating device, and dried by hot air at 70° C. for 10 minutes to obtain a film-shaped circuit connection adhesive with an adhesive layer thickness of 20 μm. Adhesive.

[0246] [Table 1]

[0247] UR-4800 YP-50 UA1 P-2M TEB-DAP TEB-DETA TnBB-MOPA DMA PEROYL-L Example 1 50 - 50 3 3 - - - 8 Example 2 50 - 50 3 - 3 ...

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Abstract

An adhesive composition comprising (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a boron-containing complex, (d) a boron-containing The complex is a compound represented by the following general formula (A). [In formula (A), R 1 , R 2 and R 3 Each independently represents a hydrogen atom, an alkyl or aryl group with 1 to 18 carbon atoms, and R 4 , R 5 and R 6 Each independently represents a hydrogen atom or a specific organic group. ]

Description

technical field [0001] The present invention relates to an adhesive composition and a bonded structure. Background technique [0002] In semiconductor elements and liquid crystal display elements, various adhesives have been used conventionally in order to bond various members in the elements. Requirements for adhesives, represented by adhesiveness, involve various aspects such as heat resistance and reliability under high temperature and high humidity conditions. The above-mentioned adhesive is used for the connection between liquid crystal display element and TCP (or COF), the connection between FPC and TCP (or COF), the connection between TCP (or COF) and printed wiring board, the connection between FPC and printed wiring board, etc. . In addition, the above-mentioned adhesive is also used when mounting a semiconductor element on a substrate. [0003] As the adherend for bonding, use a printed wiring board, or polyimide resin, polyethylene terephthalate (PET), polycarb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J201/00C08F2/44C09J4/00C09J9/02C09J11/06H01L31/05
CPCC08F2/44C09J4/00C09J9/02C09J11/06C09J201/00H01L31/05Y02E10/50H01L2224/29298H01L2224/83101H01L2224/16225H01L2224/73204H01L2224/32225H01L2924/00C09J2203/322
Inventor 伊泽弘行森尻智树立泽贵
Owner RESONAC CORPORATION
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