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Adhesive composition

A composition and adhesive technology, applied in the direction of adhesives, adhesive types, polyether adhesives, etc., can solve the problems of difficult storage stability, low activation energy, etc., and achieve excellent bonding strength and connection resistance. Effect

Active Publication Date: 2016-08-31
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in order to cure the above-mentioned adhesive at low temperature, it is necessary to use a thermal latent catalyst with low activation energy, but it is very difficult to achieve both storage stability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8 and comparative example 1～4

[0259] (Production of adhesive for circuit connection)

[0260] Compound thermoplastic resin, radical polymerizable compound and radical polymerization initiator, and boron compound or amine compound according to the solid mass such as Table 1, and further, with the adhesive component (the electrical conductivity is excluded in the adhesive for circuit connection) Based on the total volume of particle components), 1.5% by volume of conductive particles was mixed and dispersed to obtain an adhesive for circuit connection. The obtained adhesive for circuit connection was coated on a fluororesin film with a thickness of 80 μm by a coating device, and dried by hot air at 70° C. for 10 minutes to obtain a film-shaped circuit connection adhesive with an adhesive layer thickness of 20 μm. Adhesive.

[0261] Table 1

[0262]

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PUM

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Abstract

An adhesive composition which has excellent low temperature curing ability and storage stability is provided. The adhesive composition includes a thermalplastic resin (a), a radical polymerizable compound (b), a radical polymerization initiator (c) and a salt containing boron (d), and the salt (d) is a compound represented by the following formula (A). In formula (A), R1, R2 and R3 respectively and independently represent a hydrogen atom, an alkyl group having 1 to 18 carbons, or an aryl group, and X+ represents a cation containing a quaternary phosphorous atom and / or a quaternary nitrogen atom.

Description

[0001] This application is a branch of a Chinese patent application with an application date of December 17, 2012, an application number of 201210548890.0, and an invention title of "Adhesive Composition, Film Adhesive, Adhesive Sheet, and Connection Structure". case application. technical field [0002] The present invention relates to an adhesive composition, a film-like adhesive, an adhesive sheet, a bonded structure, a method for producing a bonded structure, and an application of the adhesive composition. Background technique [0003] In semiconductor elements and liquid crystal display elements, various adhesives have been used conventionally for the purpose of bonding various components in the elements. Requirements for adhesives include many aspects such as adhesiveness, heat resistance, and reliability under high-temperature and high-humidity conditions. The above-mentioned adhesive is used for connection of liquid crystal display element and TCP (COF), connection ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J175/16C09J171/12C09J9/02C09J11/06C09J7/02H05K3/32
CPCC09J9/02C09J11/06C09J171/12C09J175/06C09J175/16C09J2471/00C09J2475/00H05K3/321C08L75/16C08K5/55C08L75/06C08L71/12H01L2224/83101H01L2924/07811Y02E10/50H01L2924/00C09J7/22C09J7/30C09J7/35C09J11/00C09J201/00C09J2203/322C09J2301/41H02S30/10
Inventor 伊泽弘行有福征宏横田弘
Owner RESONAC CORPORATION
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