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Adhesive composition, film adhesive, adhesive sheet, and bonded structure

A composition and adhesive technology, applied in the direction of adhesives, adhesive types, conductive adhesives, etc., can solve the problems of difficult storage stability, low activation energy, etc., and achieve the effect of excellent bonding strength and connection resistance

Active Publication Date: 2016-09-28
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to cure the above-mentioned adhesive at low temperature, it is necessary to use a thermal latent catalyst with low activation energy, but it is very difficult to achieve both storage stability.

Method used

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  • Adhesive composition, film adhesive, adhesive sheet, and bonded structure
  • Adhesive composition, film adhesive, adhesive sheet, and bonded structure
  • Adhesive composition, film adhesive, adhesive sheet, and bonded structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～4

[0257] (Production of adhesives for circuit connection)

[0258] Compound thermoplastic resin, radical polymerizable compound and radical polymerization initiator, and boron-containing complex or amine compound according to solid mass such as shown in Table 1, and further, use adhesive agent (excluded from the adhesive for circuit connection) Based on the total volume of the components containing conductive particles), 1.5% by volume of conductive particles was mixed and dispersed to obtain an adhesive for circuit connection. The obtained adhesive for circuit connection was coated on a fluororesin film with a thickness of 80 μm by a coating device, and dried by hot air at 70° C. for 10 minutes to obtain a film-shaped circuit connection adhesive with an adhesive layer thickness of 20 μm. Adhesive.

[0259] Table 1

[0260] UR-4800

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PUM

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Abstract

The present invention relates to an adhesive composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a film-like adhesive, an adhesive sheet, and a connecting structure. ) a radical polymerization initiator, and (d) a boron-containing complex, wherein the (d) complex is a compound represented by the following general formula (A), in formula (A), R1, R2 and R3 each independently represents an aryl group with or without a substituent, and X represents an amine compound having a nitrogen atom or a phosphine compound having a phosphorus atom.

Description

technical field [0001] The present invention relates to an adhesive composition, a film-like adhesive, an adhesive sheet, a bonded structure, a method for producing a bonded structure, and an application of the adhesive composition. Background technique [0002] In semiconductor elements and liquid crystal display elements, various adhesives have been used conventionally for the purpose of bonding various components in the elements. Requirements for adhesives include many aspects such as adhesiveness, heat resistance, and reliability under high-temperature and high-humidity conditions. The above-mentioned adhesive is used for the connection between liquid crystal display element and TCP (COF), the connection between FPC and TCP (COF), the connection between TCP (COF) and printed circuit board, the connection between FPC and printed circuit board, etc. Moreover, the said adhesive agent is also used when mounting a semiconductor element on a board|substrate. [0003] As an a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/16C09J9/02C09J7/00C09J7/02H05K1/11H05K3/32H01L23/488
CPCH01L2224/2919H01L2224/2929H01L2224/293H01L2224/83101H01L2224/83851H01L2924/07811Y02E10/50H01L2924/00C09J7/22C09J7/30C09J7/35C09J11/00C09J201/00C09J2203/322C09J2301/16C09J2301/41H02S30/10
Inventor 伊泽弘行有福征宏加藤木茂树
Owner RESONAC CORPORATION
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