An organic conductive film covering device for an fpc circuit board

Abstract

The invention discloses an organic conductive film coverage apparatus of an FPC circuit board. The organic conductive film coverage apparatus comprises an apparatus body; the apparatus body adopts a rectangular hollow cavity structure; two groups of air cylinders are mounted on the top inner wall of the apparatus body; the piston rods of the two groups of air cylinders are connected with a first mounting plate; first springs are arranged on the lower surface of the first mounting plate uniformly at equal distances in the length direction; one ends, far from the first mounting plat, of the first springs are connected with a second mounting plate; a film coverage apparatus is fixed on the lower surface of the second mounting plate; a first rotary shaft is movably mounted in the middle position of the inner wall of the bottom plate of the apparatus body; and a first gear is mounted on the top of the first rotary shaft. By virtue of the organic conductive film coverage apparatus, a circuit board can be fixed in film coverage, so that film coverage can be more accurate and defective percentage can be lowered; meanwhile, the other surface can be subjected to film coverage quickly and conveniently, so that operation time can be reduced and production efficiency can be improved; and in addition, the apparatus is simple in structure, creative in design and worthy of popularization.

Description

technical field [0001] The invention relates to the technical field of organic conductive film covering, in particular to an organic conductive film covering device for an FPC circuit board. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability. In the production process, in order to prevent excessive open and short circuits from causing low yield or reduce rough process problems such as drilling, calendering, and cutting. The problem of FPC board scrapping and refilling, and the evaluation of how to select materials to achieve the best effect of flexible circuit boards used by customers, pre-production pretreatment is particularly important. [0003] In the pre-production pretreatment, the circuit board needs to be coated to make the coated cir...

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Problems solved by technology

[0003] In the pre-production pretreatment, the circuit board needs to be coated to make the coated circuit board have better performance, but in the existing pre-production pre-treatment process of the circuit board, when the circuit board is coated , in order to improve efficiency, the circuit board is not fixed, so that the coating may deviate, resulting in more defective products, wasting costs, and the operation of double-sided coating of the circuit board is troublesome, wasting time and reducing production efficiency

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