Process for adding PT film to cover film of flexible circuit board

Abstract

The invention discloses a process for adding a PT film to a flexible circuit board cover film, which comprises a machine body, an air cylinder is arranged at the top end of the machine body, a hot pressing plate is arranged at the output end of the air cylinder, a hot pressing table is rotatably connected to the surface of the machine body along the lower part of the hot pressing plate, and a control box is arranged on the side surface of the machine body. The problems that a cover film material is unstable in expansion and contraction, the cover film can be expanded and contracted due to various factors such as environment, temperature and humidity, a glue system, transportation and storage, and the cover film cannot be matched with a base material main board during final processing, so that the production operation efficiency is low, the deviation condition occurs, and bad scrapping can be generated due to deviation are solved. By improving and optimizing the structure of the covering film, a layer of PT film is added on the surface of the covering film, the strength of the covering film is improved through the PT film, and then the expansion and shrinkage of the covering film are controlled, so that the covering film can be quickly and effectively attached to the surface of the flexible circuit board when the surface of the flexible circuit board is subjected to film covering processing.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a process for adding a PT film to a flexible circuit board cover film. Background technique [0002] The flexible circuit board is referred to as FPC, and its main features are light, thin, and bendable. During the processing of the flexible circuit board, the product needs to be covered with a cover film to protect the etched circuit after etching, so as to ensure that the etched circuit can be more stable and avoid The etched circuit is easy to be damaged, but the following problems will occur in the actual operation process: the existing cover film auxiliary materials are thinner, and the expansion and contraction of the cover film material itself is relatively unstable, due to the environment, temperature and humidity, adhesive system, transportation, Various storage factors will cause the cover film to expand and shrink, and the final processing will not mat...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a process for adding PT film to the cover film of a flexible circuit board, which aims to improve the existing cover film auxiliary materials. , Storage of various factors will cause the cover film to expand and shrink, and the final processing cannot be consistent with our base material motherboard, resulting in slow production operation efficiency and misalignment, and misalignment will cause bad scrap problems

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