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Splicing heat-preservation plate with adjustable thickness

A technology of splicing and thermal insulation boards, applied in thermal insulation, building components, construction, etc., can solve the problems of non-adjustable thickness of thermal insulation boards, low material utilization rate, and volatilization of glue, so as to facilitate splicing and installation, improve aesthetics, and improve adhesion The effect of fit

Inactive Publication Date: 2017-12-22
南京淳飞怿建筑科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a structure has the following disadvantages. First, it is bonded by glue, and the glue will volatilize when it is used later, which is not environmentally friendly; 2. The thickness of the insulation board cannot be adjusted. Die processing, low material utilization

Method used

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  • Splicing heat-preservation plate with adjustable thickness

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Embodiment Construction

[0010] The present invention will be further described below in conjunction with the embodiments and with reference to the accompanying drawings. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the direction in the figure, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0011] Such as figure 1 The spliced ​​insulation board with adjustable thickness includes a base layer 1 , a surface layer 9 and an insulation layer 7 arranged between the base layer 1 and the surface layer 9 .

[0012] Expansion bolts 2 are arranged on the inner side of the base layer 1, expansion bolts are arranged on the inner side of the surface layer 9, and the ...

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Abstract

The invention discloses a spliced ​​thermal insulation board with adjustable thickness, which comprises a base layer, a surface layer and an insulation layer arranged between the base layer and the surface layer, expansion bolts are arranged on the inner side of the base layer, and expansion bolts are arranged on the inner side of the surface layer. Bolts and expansion bolts are respectively connected with connecting screws, and the two connecting screws are connected through an adjustable connecting sleeve. Cover plates covering the insulating layer are respectively arranged on the four end faces of the insulating layer. Protruding plugs and slots are respectively arranged on the upper and upper and lower end faces. The invention connects the base layer and the surface layer through a connecting screw and an adjustable connecting sleeve, can adjust the distance between the base layer and the surface layer, can reduce the bonding of glue, and has the effect of environmental protection; by setting the slot to insert the block The structure is convenient for splicing and installation, which can improve the fit between each insulation board, reduce the gap between each insulation board, and improve the aesthetics.

Description

technical field [0001] The invention relates to a thermal insulation board for buildings, in particular to a spliced ​​thermal insulation board with adjustable thickness. Background technique [0002] In the construction field, in order to ensure the energy saving and environmental protection of the building, thermal insulation boards are generally used on the outer walls of the buildings to increase the heat insulation effect. The existing thermal insulation boards basically have a surface layer and a base layer plus an insulation layer in the middle. Composed, the insulation layer is designed as a whole block, and is fixed with the base layer and the surface layer by glue. Such a structure has the following disadvantages. First, it is bonded by glue, and the glue will volatilize when it is used later, which is not environmentally friendly; 2. The thickness of the insulation board cannot be adjusted. The mold is processed, and the material utilization rate is low. Conten...

Claims

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Application Information

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IPC IPC(8): E04B1/80
CPCE04B1/80E04B1/7608E04B2001/7695
Inventor 俞鹏飞
Owner 南京淳飞怿建筑科技有限公司
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