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Glue smearing equipment and method for smearing glue

A technology of coating glue and equipment, applied in nonlinear optics, instruments, optics, etc., can solve the problems of excessive thickness of glue on the chip, unprotected coating, and thinning of interference risk, so as to improve production efficiency, The effect of meeting market demand

Inactive Publication Date: 2017-12-26
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the embodiments of the present invention is to provide a glue coating setting and a glue coating method to solve the risk of interference caused by excessive thickness of glue on the chip in the prior art and incomplete coating caused by thinner glue thickness Technical issues with not being able to protect the die bonding area

Method used

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  • Glue smearing equipment and method for smearing glue
  • Glue smearing equipment and method for smearing glue
  • Glue smearing equipment and method for smearing glue

Examples

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no. 1 example

[0048] figure 1 It is a top view structure diagram of the glue coating equipment of the embodiment of the present invention. figure 2 for figure 1 A-A view of the. exist figure 1 and figure 2 Among them, the alignment button of the glue distribution device is set on the chip bonding area of ​​the substrate. combine figure 1 and figure 2, the glue coating equipment includes a stage 11 for carrying a substrate 10 , a glue applying device 12 and a glue distributing device 13 for applying glue. The chip bonding area of ​​the substrate 10 is provided with a plurality of chips 102 and a non-chip area 103 . After being aligned with the chip binding area, the glue distributing device 13 is fastened on the chip binding area. The glue distributing device 13 is provided with a shielding structure 132 covering the area of ​​the chip and a hollow structure 131 exposing the area 103 other than the chip. The gluing device 12 applies glue to the gluing device 13 . The blocking st...

no. 2 example

[0061] Based on the inventive concepts of the aforementioned embodiments, the embodiments of the present invention also provide a method for applying glue by using the above-mentioned glue coating equipment, the method comprising:

[0062] S1: setting the substrate on the stage;

[0063] S2: Set the alignment buckle of the glue distribution device on the chip binding area of ​​the substrate, and the glue distribution device is provided with a shielding structure covering the chip area and a hollow structure exposing the area other than the chip;

[0064] S3: The glue applying device applies glue to the glue distributing device, so that the glue passes through the hollow structure of the glue distributing device and fills the area outside the chip.

[0065] In a preferred embodiment, the alignment buckle of the glue dispensing device on the chip bonding area of ​​the substrate may include:

[0066] Fix the glue distribution device to the connecting arm in position;

[0067] T...

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Abstract

The invention discloses glue smearing equipment and a method for smearing glue. The glue smearing equipment comprises a loading table, a glue spreading device and a glue smearing device, the loading table is used for loading a substrate, and multiple chips are arranged in a chip binding area of the substrate; the glue spreading device is used for oppositely covering the chip binding area of the substrate and is provided with a shielding structure which covers the chip area and a hollow structure which exposes the area except the chips; the glue smearing device is used for smearing the glue to the glue spreading device, so that the glue fills the area except the chip through the hollow structure of the glue spreading device. The glue smearing equipment can complete glue smearing in one time, it is guaranteed that no glue is smeared on the chips, the market requirement is met, and the production efficiency is improved. No glue is on the chips, the interference risk is avoided since the thickness of the applied glue on the chips exceeds a polaroid at the array substrate side, the glue is only smeared in the area except the chips, the glue with the enough thickness can be smeared, and the protection effect of the glue on the chips binding area is achieved. The invention further discloses a method for using the glue smearing equipment to smear the glue.

Description

technical field [0001] The invention relates to the technical field of display device production, in particular to a glue coating device and a glue coating method. Background technique [0002] In the field of display technology, liquid crystal display panels are widely used due to their advantages of small size, no radiation, and high resolution. As display panels become thinner and thinner, and their resolutions are higher and higher, the glass substrates used in display panels are thinner, and more driver chips are required to achieve high resolution. The glass substrate becomes thinner, which requires the thickness of the Tuffy glue coated on the chip bonding area of ​​the panel to be thinner, and because the number of driving chips in the chip bonding area increases, the coating of Tuffy glue becomes more difficult . [0003] In order to simplify the coating process and reduce the risk of the gluing device colliding with the chip when coating the Tuffi glue in the chi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G02F1/1345
CPCG02F1/1303G02F1/13452
Inventor 胡凌霄王晶杨怀伟房凯迪
Owner BOE TECH GRP CO LTD