A high damping thermal deformation releasing device

Abstract

The invention relates to a high-damping heat deformation release device which comprises a base (1), an elastic element (2), a shell (3), a damping element (4) and a connection base (5). The lower end of the elastic element (2) is fixedly connected with the base (1), the elastic element (2) is perpendicular to the base (1), the upper end of the elastic element (2) is fixedly connected with the connection base (5), the rigidity of the elastic element (2) in the direction perpendicular to the base (1) is larger than the rigidity of the elastic element (2) in the direction parallel to the base (1), the shell (3) is connected with the base (1) and used for wrapping the elastic element (2), the space between the elastic element (2) and the shell (3) is filled with the damping element (4), a gap exists in the contact face between the damping element (4) and the elastic element (2), the gap is used for adjusting the contact area of the damping element (4) and the elastic element (2), and the volume ratio of the gap in the damping element (4) is inversely proportional to the damping coefficient of the damping element (4) and the rigidity of the elastic element (2).

Description

technical field [0001] The invention relates to the technical field of flexible connection, in particular to a high-damping thermal deformation releasing device. Background technique [0002] The large-scale flat-panel phased array antenna used by microwave remote sensing spacecraft is affected by the change of the sun's irradiation angle in the orbital environment, and the temperature will fluctuate to a certain extent. In order to ensure the light weight and high strength of the structure, the antenna mounting frame is mostly made of carbon fiber material. The antenna itself must use metal materials in order to ensure electrical performance. The thermal expansion characteristics of the two materials are quite different. When the temperature changes, the thermal deformation of the two materials is not coordinated, which will cause the structure to warp and deform, which will change the antenna beam pointing and affect the detection performance. Optical remote sensing sate...

AI Technical Summary

Problems solved by technology

[0004] The technical solution of the present invention is to overcome the deficiencies of the prior art and provide a high-damping thermal deformation release device, which can solve the problem of thermal stress caused by thermal deformation caused by high-frequency vibration of two structural components connected by flexible structural components. , the relative displacement of flexible structural parts is relatively large, resulting in the problem of high structural stress

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