A dielectric guided wave structure and a dielectric guided wave transmission system
A medium and guided wave technology, applied in the direction of waveguide, waveguide-type devices, electrical components, etc., can solve the problems of SIW metallized hole processing difficulty, structural parts processing flatness, air gap assembly accuracy, etc.
Active Publication Date: 2020-07-28
HUAWEI TECH CO LTD
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Problems solved by technology
[0007] In order to solve the problems in the prior art that the processing of SIW metallized holes is difficult, the processing flatness of gap waveguide on structural parts and the assembly accuracy of air gap are high, the embodiment of this application provides a dielectric guided wave structure and a dielectric guided wave transmission system, through The PCB process can realize the processing of the dielectric guided wave structure and the dielectric guided wave transmission system
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[0057] Embodiments of the present application are described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Those of ordinary skill in the art can see that with the development of technology, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.
[0058] Figure 4 It is a three-dimensional structural diagram of the dielectric waveguide structure 100 in the embodiment of the present application.
[0059] Figure 5 For the embodiment of this application Figure 4 The shown dielectric waveguide structure 100 is a side view in the direction where two groups of adjacent substructures can be seen.
[0060] Such as Figure 4 As shown, the dielectric waveguide structure 100 provided by the embodiment of the present application includes: a first metal layer 101 , a second metal...
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The invention discloses a dielectric waveguide structure, which comprises a first metal layer, a first dielectric layer, a second dielectric layer, a second metal layer and two groups of adjacent substructures, wherein the first metal layer, the first dielectric layer, the second dielectric layer and the second metal layer are sequentially arranged from top to bottom; each group of substructures comprise at least two substructures; at least two substructures comprise at least one mushroom structure, wherein each mushroom structure comprises a first plated-through hole and a corresponding metalgraph layer; at least two grooves are formed in one side, toward the second dielectric layer, of the first dielectric layer, an opening of each groove is toward the second dielectric layer and each groove accommodates one metal graph layer; at least two first plated-through holes are formed in the second dielectric layer and each first plated-through hole penetrates through the second dielectriclayer; and a structure enclosed by the first metal layer, the second metal layer and the two groups of adjacent substructures is the dielectric waveguide structure. According to the dielectric waveguide structure, processing of the dielectric waveguide structure can be achieved through a PCB technology.
Description
technical field [0001] The present application relates to the technical field of communication, and in particular to a dielectric guided wave structure and a dielectric guided wave transmission system. Background technique [0002] In microwave communication systems, the performance requirements of hardware systems are getting higher and higher. At present, the antenna on board (AOB) module has become the preferred technical solution of the microwave system. The AOB module is to package the functional modules such as the antenna array, power distribution network, coupling network, filter network and chip control line in the in an independent media module. In order to facilitate assembly with a printed circuit board (print circuit board, English abbreviation: PCB) system, the AOB module usually has a planar structure. [0003] Such as figure 1 As shown, the AOB module includes a plurality of dielectric layers 20 and signal layers 30 arranged at intervals in sequence, an an...
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IPC IPC(8): H01P3/16H01P1/20H01P5/12H01P5/16
Inventor 王华红相亮亮盛海强
Owner HUAWEI TECH CO LTD