Semiconductor structure and a manufacturing method thereof

Abstract

A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface and a recess extending from the first surface towards the second surface, a first die at least partially disposed within the recess and including a first die substrate and a first bonding member disposed over the first die substrate, a second die disposed over the first die andincluding a second die substrate and a second bonding member disposed a second die substrate and the second die substrate, a redistribution layer (RDL) disposed over the second die, and a conductive bump disposed over the RDL, wherein the first bonding member is disposed opposite to and is bonded with the second bonding member.

Description

technical field [0001] Embodiments of the present invention relate to semiconductor structures and manufacturing methods thereof. Background technique [0002] Electronic instruments using semiconductor devices are necessary for many modern applications. As electronic technology advances, semiconductor devices become smaller in size while having greater functionality and a greater number of integrated circuits. Due to the miniaturization of semiconductor devices, wafer level packaging (WLP) is widely used due to its low cost and relatively simple manufacturing operations. During WLP operation, many semiconductor components are assembled on the semiconductor device. Also, a large number of manufacturing operations are performed within such a small semiconductor device. [0003] However, the manufacturing operation of a semiconductor device involves many steps and operations on such a small and thin semiconductor device. The manufacture of miniaturized semiconductor device...

AI Technical Summary

Problems solved by technology

The complexity of the manufacturing operations of semiconductor devices increases because more diverse components are involved

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