A packaging substrate, oled display panel and packaging method thereof
A technology for encapsulating substrates and display panels, applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as uneven distribution and uncontrollable fluidity of encapsulation glue, and achieve improved uniformity, improved fluidity, and controllable flow direction Effect
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[0035] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0036] combine figure 2 and Figure 5 As shown, the present invention provides a packaging substrate 1, the packaging substrate 1 includes a base substrate 11, and also includes a plurality of first spacers 12 disposed on the base substrate 11, and each first spacer 12 is formed for The guiding channel 13 of the packaging glue 2 is guided, and the packaging glue 2 can diffuse along the guiding channel 13 . Figure 5 The direction indicated by the middle arrow is the flow and diffusion d...
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