Cabinet heat dissipation structure
A heat dissipation structure and chassis technology, applied in the field of heat dissipation, can solve the problems of poor utilization efficiency of the internal space of the chassis and poor heat dissipation effect, increasing the volume of the server host, and a small number of server hosts.
Pending Publication Date: 2018-01-19
ASIA VITAL COMPONENTS (CHINA) CO LTD
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Problems solved by technology
[0003] However, it is known that the heat dissipation structure arranged on the server host itself dissipates heat on the server host itself, which will lead to an additional increase in the volume of the server host, especially the server host is stacked inside the chassis carrying the server host, and each server More than one heat dissipation structure is installed on the mainframe, resulting in a small number of server hosts that the known chassis can carry. In the case where the volume of the server host and its heat dissipation structure cannot be reduced, the utilization efficiency of the internal space of the chassis and the cooling effect are relatively low. Difference
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[0057] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.
[0058] see figure 1 , 2 , 3 and 4 are the three-dimensional exploded view, the three-dimensional combination diagram, the side view of the heat dissipation module and the heat conduction unit, and the three-dimensional combination diagram of the heat dissipation module and the heat conduction unit of the first embodiment of the chassis heat dissipation structure of the present invention. As shown in the figure, this The chassis heat dissipation structure 10 described in the invention includes a chassis body 110, the chassis body 110 has a frame 111, a heat dissipation module 112 and at least one heat conduction unit 114a, and the frame 111 is provided for at least one server host 20.
[0059]In this embodiment, the rack 111 is shown as being provided for a server host 20 to be install...
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The invention discloses a cabinet heat dissipation structure, and the structure comprises a cabinet body which is provided with a rack, a heat dissipation module group and at least one heat conductionunit. The rack is used for the setting of at least one server main unit. The heat dissipation module group is provided with at least one heat dissipation unit and a plurality of fan units. The heat dissipation units are disposed between the fan units and the server main unit. Each heat conduction unit is provided with at least one first terminal and one second terminal, wherein the first terminalmakes contact with a heating module group of the server main unit, and the second terminal makes contact with the heat dissipation units. The heat conduction units conduct the heat of the heating module group to the heat dissipation units, and the heat dissipation units carry out heat dissipation through the fan units. According to the invention, the design can effectively improve the heat dissipation effect of the internal space of the cabinet body and the space utilization effect.
Description
【Technical field】 [0001] The invention relates to the field of heat dissipation, in particular to a heat dissipation structure of a chassis. 【Background technique】 [0002] Press, in recent years, with the advancement of science and technology, the operating speed of the server mainframe has been continuously improved, and thus the heating power of the electronic components inside the server mainframe has been continuously rising. In order to prevent the electronic components inside the server host from overheating and resulting in failure of the electronic components, it is necessary to provide sufficient heat dissipation performance for the electronic components. Therefore, it is known to provide a heat dissipation structure on the server host. [0003] However, it is known that the heat dissipation structure arranged on the server host itself dissipates heat on the server host itself, which will lead to an additional increase in the volume of the server host, especially t...
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IPC IPC(8): H05K7/20
Inventor 林源忆
Owner ASIA VITAL COMPONENTS (CHINA) CO LTD