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Wafer shift detection method and device, and semiconductor processing equipment

A technology for offset detection and position detection, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc. It can solve problems such as wasting wafers, production capacity decline, and cavity cleaning, so as to avoid waste and improve The effect of capacity

Active Publication Date: 2020-10-13
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Yet adopt above-mentioned wafer existence detection device to find in actual application: wafer presence detection device 13 can still detect that there is a piece under the wafer position deviation situation, continue to carry out the film transmission process afterwards, but, in the film transmission process The position of the wafer is shifted, which is easy to cause the problem of wafer falling and debris, which not only wastes the wafer, but also needs to open the cavity to clean the cavity, resulting in a decrease in production capacity

Method used

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  • Wafer shift detection method and device, and semiconductor processing equipment
  • Wafer shift detection method and device, and semiconductor processing equipment
  • Wafer shift detection method and device, and semiconductor processing equipment

Examples

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Embodiment 1

[0034] figure 2 A flow chart of a wafer offset detection method provided by an embodiment of the present invention; image 3 is a schematic diagram of the manipulator at the initial position; Figure 4 It is the first schematic diagram of the manipulator at the first preset position. Please also refer to Figure 2-Figure 4 , the wafer displacement detection method provided by the embodiment of the present invention is used to detect whether the wafer 1 on the manipulator 111 has a position displacement through the detection unit, including the following steps:

[0035] S1, driving the manipulator 111 to rotate from an initial position to a first preset position by a first angle along a first rotation direction.

[0036] Specifically, the detection unit is used to detect whether there is a wafer 1 on the manipulator 111 , and it is generally but not limited to: disposed directly above and directly below the wafer 1 .

[0037] More specifically, the working principle of the...

Embodiment 2

[0063] Figure 10 A functional block diagram of a wafer offset detection system provided by an embodiment of the present invention. see Figure 10 , the wafer deviation detection device provided by the embodiment of the present invention is used to detect whether the wafer on the manipulator 111 has a position deviation through the detection unit 20, and includes a drive unit 22 and a control unit 23.

[0064] Wherein, the driving unit 22 is used to drive the manipulator 111 to rotate from the initial position by a first angle to the first preset position along the first rotation direction. The control unit 23 is used to determine whether the position of the wafer 1 is shifted according to the detection unit 20 detecting whether the wafer 1 exists on the manipulator 111 at the first preset position. Wherein, the first preset position is set to meet the following requirements: after the manipulator 111 carrying the wafer 1 at an accurate position rotates the first angle along...

Embodiment 3

[0074] The embodiment of the present invention also provides a semiconductor processing equipment, including a wafer deviation detection device, the wafer deviation detection device provided in the above-mentioned embodiment 2 of the present invention.

[0075]Specifically, semiconductor processing equipment includes, but is not limited to, plasma etching equipment.

[0076] The semiconductor processing equipment provided in this embodiment can not only avoid waste of wafers, but also increase productivity by adopting the wafer deviation detection device provided in the above embodiments of the present invention.

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Abstract

The invention provides a wafer offset detection method and an apparatus, and semiconductor processing equipment. The method is used for detecting whether a wafer on a manipulator generates a positionoffset through a detection unit and comprises the following steps of driving the manipulator to rotate a first angle to a first preset position from an initial position along a first rotation direction; and according to the detection unit, detecting whether a wafer signal condition exists in the manipulator at the first preset position so as to determine whether the wafer generates the position offset, wherein the first preset position satisfies the following requirement arrangement that the manipulator which is loaded with the wafer with the accurate position rotates the first angle along thefirst rotation direction, and then a detection position of the detection unit is located at a position which is close to a wafer boundary. By using the wafer offset detection method and the apparatus, a problem that the wafer drops out and fragments are generated because of the wafer offset during a subsequent transmission process can be avoided; and wafer wastes are prevented, times for openinga cavity and cleaning the cavity can be reduced, and production capacity is increased.

Description

technical field [0001] The invention belongs to the technical field of microelectronic processing, and in particular relates to a wafer offset detection method and device, and semiconductor processing equipment. Background technique [0002] In the fields of integrated circuits, semiconductor photos, etc., plasma dry etching equipment is usually used to etch wafers to obtain the desired morphology. In order to improve the production capacity of etching equipment, a robot is used to realize automatic loading and unloading of wafers. General etching equipment includes a cassette cavity, a transport cavity and a process cavity, wherein the cassette cavity is used to place a cassette for carrying a plurality of wafers; Take it out and transfer it to the process chamber to carry out the process in the process chamber. After the process is completed, the manipulator will transfer the processed wafer back from the process chamber to the cassette chamber. [0003] In order to ensu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67
Inventor 宋俊超
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD