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Vacuum compatible LED substrate heater

A technology of light-emitting diodes and heaters, which is applied in the manufacture of ohmic resistance heating devices, semiconductor devices, and semiconductor/solid-state devices, etc., can solve the problems of large infrared lamps, space consumption, and low efficiency of heating substrates.

Inactive Publication Date: 2018-02-16
VARIAN SEMICON EQUIP ASSOC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, IR lamps are fairly inefficient for heating substrates
Also, infrared lights can be quite large and consume a lot of space in the room

Method used

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  • Vacuum compatible LED substrate heater
  • Vacuum compatible LED substrate heater
  • Vacuum compatible LED substrate heater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] As noted above, in many applications it may be advantageous to preheat the substrate prior to processing it. In addition, substrates are often processed in chambers maintained under vacuum conditions.

[0019] The use of vacuum conditions presents many challenges to the design of LED substrate heaters. For example, the choice of materials that can be used to construct LED substrate heaters can be limited because many materials can outgas, contaminating the chamber. In addition, a sealed housing disposed within the chamber may have a pressure differential between the interior of the housing and the chamber, which may subject the walls of the sealed housing to significant or unacceptable stress. Additionally, excess heat generated by the LED substrate heater should be removed, which can be made more difficult by the lack of air in the chamber.

[0020] figure 1 A perspective view of a first embodiment of an LED substrate heater 100 compatible with vacuum conditions is ...

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PUM

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Abstract

A system for heating substrates within a chamber, which may be maintained at vacuum conditions, is disclosed. The LED substrate heater comprises a base having a recessed portion surrounded by sidewalls. A plurality of light emitting diodes (LEDs) are disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon or a coating on the silicon, thus efficiently and quickly heating the substrate. A transparent window is disposed over the recessed portion, forming a sealed enclosure in which the LEDs are disposed. A sealing gasket may be disposed between the sidewalls and the window.

Description

technical field [0001] Embodiments of the invention relate to a system for heating a substrate, and more particularly, for heating a substrate, eg, using light emitting diodes in a vacuum chamber. Background technique [0002] The manufacture of semiconductor components involves several discrete and complex processes. Semiconductor substrates typically undergo many processes during the manufacturing process. These processes can be performed in process chambers that can be maintained under process conditions that differ from the environment. For example, the processing chamber can be maintained under vacuum conditions. [0003] Heating substrates prior to processing and / or after processing is common in many semiconductor manufacturing processes. In many cases, the substrate is heated to a temperature close to the process temperature and then transported to a platen. Such preheating can help prevent substrate warping, popping and shifting when a cold substrate contacts a h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L33/00
CPCH01L21/67109H01L21/67115H05B3/0047H01L21/67098H01L21/67207H01L33/00
Inventor 罗伯特·布然特·宝佩特盖瑞·E·维卡大卫·伯拉尼克杰森·M·夏勒威廉·T·维弗
Owner VARIAN SEMICON EQUIP ASSOC INC