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Heat dissipation assembly

A technology of heat dissipation components and components, which is applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., and can solve the problems affecting the flow rate and flow rate of the internal working fluid, affecting the heat dissipation efficiency, etc.

Inactive Publication Date: 2018-03-13
ACER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is easy to affect the flow rate and flow rate of the working fluid in it, and then affect its heat dissipation efficiency

Method used

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  • Heat dissipation assembly
  • Heat dissipation assembly
  • Heat dissipation assembly

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Embodiment Construction

[0026] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

[0027] figure 1 It is a schematic diagram of a heat dissipation component applied in an electronic device according to an embodiment of the present invention, wherein the outer outline is drawn with dotted lines to facilitate identification of components inside. figure 2 yes figure 1 An enlarged view of a part of an electronic device. Please also refer to figure 1 and figure 2 , in this embodiment, the electronic device 200 is, for example, a tablet computer, and has a heat source 210, which is, for example, a processor or a display chip disposed on a circuit board 220, and along with the circuit board 220 disposed in the internal space of the electronic device 200 left side. Meanwhile, the electronic device 200 further includes a battery 230 , which i...

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Abstract

The invention provides a heat dissipation assembly applicable to an electronic apparatus. The electronic apparatus comprises a heat source; the heat dissipation assembly comprises an evaporator, a main pipe part and at least one following pipe part; the evaporator is in thermal contact with the heat source; the main pipe part is connected with the evaporator and has at least one discontinuous part; the following pipe part is connected with the main pipe part and positioned in the discontinuous part; the evaporator, the main pipe part and the following pipe part form a loop, and the loop is filled with a working fluid; the liquid-state working fluid performs heat absorption and phase change in the evaporator to be changed into a vapor-state working fluid to be separated from the evaporator;and the vapor-state working fluid flows through the main pipe part and the following pipe part and performs heat dissipation and phase change to be changed into the liquid-state working fluid to flowto the evaporator to be circulated in the loop.

Description

technical field [0001] The invention relates to a heat dissipation assembly. Background technique [0002] With the advancement of science and technology, the existing mobile electronic devices are moving towards the trend of light, thin and short appearance, so the structural configuration also tends to be compact, resulting in insufficient space. In order to allow mobile electronic devices to have both the required execution performance and heat dissipation performance, mechanism designers are often faced with the need to configure the components required for the above performance in a limited space, and at the same time also need to take into account the overall structure to avoid insufficient structural strength Therefore, it often creates considerable troubles for mechanism designers. [0003] However, such a compact structure often conflicts with the disposition of the heat dissipation components, or makes the utilization of the internal space of the mobile electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/20327
Inventor 王勇智廖文能谢铮玟
Owner ACER INC