A detection method and device for performing subregional comparative scanning on the surface of a chip

Abstract

The invention provides detection method and equipment for performing regional comparison scanning on a chip surface. The detection method and equipment is applied to scanning equipment. The detectionmethod comprises the following steps of providing a chip to be detected; analyzing a pattern structure of the chip to be detected so as to obtain density structures of different regions of the chip tobe detected; building a density structure distribution diagram according to distribution of the density structure of the chip to be detected at different regions; allowing the regions of different density structures to be corresponding to a window scanning mode according to the density structure distribution diagram so as to form a scanning distribution diaphragm; and providing the correspondingwindow scanning mode for the regions of different density structures by the scanning equipment according to the scanning distribution diagram so as to perform optical scanning test. The detection method provided by the technical scheme has the beneficial effects that the corresponding window scanning mode is employed to scan with regard to the regions of different density structures, and the problem that the machine table yield is scarified brought by the same window scanning mode employed to scan with regard to the regions of different density structures can be prevented.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing technology, in particular to a detection method and equipment for performing subregional comparative scanning on the surface of a chip. Background technique [0002] In the production process of large-scale integrated circuit wafers, it is necessary to detect defects in different processes in a timely manner, and timely feedback the defects to the process equipment for defect improvement and process adjustment. [0003] The currently used scanning machines are mainly bright-field detection equipment and dark-field detection equipment, among which bright-field detection equipment is often used as the main post-process in the wafer production process due to its high sensitivity and more optical detection bands. means of monitoring. [0004] With the development of integrated circuit technology and the scaling down of key dimensions, as well as the increase in the complexity...

AI Technical Summary

Problems solved by technology

[0005] However, there are areas with different pattern densities and pattern structures in the same chip. At present, for the same product, the same scanning program can only use the same comparison window for comparison. Although the scanning sensitivity of key areas can be guaranteed, some of the pattern densities Low, scanning of relatively non-critical areas does not need to use a small contrast window for scanning, which will sacrifice machine productivity

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