Cutting device and cutting method of non-metallic material using rollers

Abstract

Disclosed is a non-metal material breaking apparatus that can also enhance a success rate in breaking a non-metal substrate, such as glass having a small trim width and thickness. The non-metal material breaking apparatus comprises a support roller, a pusher roller, a frame, and a moving module. The support roller supports the upper or lower surface of a trim area of a non-metal substrate such that the upper or lower surface of the trim area is inclined at a predetermined angle relative to the surface of the non-metal substrate. The pusher roller is located opposite to the support roller to press an area of the non-metal substrate that corresponds to a breaking line. The frame supports the support roller and the pusher roller. The moving module relatively moves the non-metal substrate or the frame.

Description

technical field [0001] The present invention relates to a cutting device and a cutting method for non-metallic materials, and more specifically relates to a cutting device and a cutting method for cutting non-metallic materials such as glass substrates with rollers. Background technique [0002] Along with the mass production of electronic devices equipped with displays, cutting devices for non-metallic substrates such as glass substrates constituting the surface of the displays are widely used. [0003] Regarding the cutting of this kind of non-metallic substrate, the existing mechanical method is limited by the length of the bar (Bar). The longer the length of the non-metallic material to be segmented, the possibility of deformation (twist) of the bar (Bar) The higher the precision, the higher the precision of machining such as flatness and squareness. Moreover, according to the mechanical precision, the wear of a specific position is serious, and the load of the bar is a...

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Problems solved by technology

Moreover, according to the mechanical precision, the wear of a specific position is serious, and the load of the bar (Bar) is also high, so the load and size of the structure supporting the bar (Bar) will eventually increase.

[0004] Moreover, the shorter the width of the trimming edge (Trim), the thinner the thickness of the glass, the lower the cutting success rate (broken) of the cutting device (Breaker) in the form of a bar (Bar), and the segmental section roughness (Hackle), right angle deviation (= right angle) quality degradation

In particular, as a greater number of substrates are formed on one mother substrate to reduce the production unit price, the trim between the substrates becomes smaller, and in the case of mobile devices and the like, reductions in weight are being made. Thickness of thin glass, so this problem is exacerbated by

[0005] The non-contact splitting method using laser is also limited to splitting according to the processing state of the cracks formed on the cutting line (the uniform depth should be kept at least 80% of the glass thickness), so the splitting conditions are harsh

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