Device and method for controlling shape change of flexible electronic device

Abstract

The invention provides a device and method for controlling the shape change of a flexible electronic device and aims to solve the problem that the shape change of an existing flexible electronic device cannot be controlled precisely. The device comprises a support and a controller and is characterized in that a slide mechanism and a plurality of first shape change components are arranged on the support, the first shape change components are parallelly arranged, each first shape change component is connected with the controller and provided with a second shape change component fitting a to-be-detected flexible electronic device, and each second shape change component is fixed on the slide mechanism through a clamp component and has a first position during mounting and a second position driven by the corresponding first shape change component below the second shape change component to have shape change. The method includes: using the controller to perform shape change control on shape change parts on different first shape change components so as to precisely control the shape change of the flexible electronic device. The device is small in applied voltage, safe and reliable in action, long in service life and the like.

Description

technical field [0001] The invention relates to the technical field of deformation control of flexible electronic devices, in particular to a device and method for controlling deformation of flexible electronic devices. Background technique [0002] In flexible electronic device technology, it is often necessary to control the position and shape of some flexible electronic devices with high precision. At present, the position control of flexible electronic devices is mainly realized by means of mechanical structure movement or thermal strain. The position control of flexible electronic devices is realized through mechanical structure movement, such as using a ball screw mechanism to convert rotational motion into linear motion, thereby realizing The position change of flexible electronic devices; the deformation of flexible electronic devices is realized by using thermal strain method, such as using a flexible electronic thin film device with a small thermal expansion coeffi...

AI Technical Summary

Problems solved by technology

The method of realizing the deformation of flexible electronic devices by means of mechanical structure movement will affect the position accuracy of flexible electronic devices due to factors such as manufacturing errors, assembly errors, and installation errors of the mechanical structure, and can only achieve displacement changes of flexible electronic devices, not according to the flexibility. Different shapes of electronic devices require corresponding deformations; the thermal strain method is used to realize the deformation of flexible electronic devices, and the thermal strain loading device is subject to temperature control and the accuracy of thermal expansion coefficient measurement, which affects the deformation accuracy, and the temperature is too high. performance impact

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