Wire rubber coating method
A wire and glue-covering technology, which is applied in the manufacture of circuits, electrical components, cables/conductors, etc., can solve problems such as wire deviation, low efficiency, and different thicknesses of insulation layers.
Active Publication Date: 2018-05-04
深圳市伟隆盛电子有限公司
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Problems solved by technology
However, in the existing wire encapsulation technology, the surface of the wire is generally insulated by dipping. This method of outsourcing insulation is inefficient, and the thickness of the encapsulation is uneven, and the gap after encapsulation is large, which is easy Wire core deviation occurs
There are also some straight-through rubber covering devices in the industry. The wire core is coated and insulated on the wire core through the through hole containing the insulating glue. The problem of different thickness of insulation layer
Method used
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[0052] The present invention will be further explained below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.
[0053] Such as figure 1 As shown, a wire encapsulating device includes a frame 1, an electrical cabinet 2, an operation panel 3 and a characteristic mechanism 4, and the upper part of the electrical cabinet 2 is equipped with a frame 1 and a characteristic mechanism 4, and the frame 1 is used for Support characteristic mechanism 4, said characteristic mechanism 4 comprises crimping line encapsulation mechanism 41, tape feeding and cutting mechanism 42 and moving rolling line mechanism 43, and said tape feeding and cutting mechanism 42 can cut off and convey the rolled tape roll To the crimping glue-covering mechanism 41, the crimping glue-covering mechanism 41 coopera...
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The invention relates to a rubber coating method based on a wire rubber coating device, and aims to solve the problems that an existing wire rubber coating device is extremely low in efficiency, rubber coating thickness is nonuniform, and a wrapped gap is wide. The wire rubber coating device comprises a frame, an electrical cabinet, an operating panel and a characteristic mechanism, the frame andthe characteristic mechanism are mounted on the upper portion of the electrical cabinet, the frame is used for supporting the characteristic mechanism, the characteristic mechanism comprises a wire pressing and rubber coating mechanism, an adhesive tape feeding and cutting mechanism and a movable wire rolling mechanism, the operating panel is mounted on the frame and comprises a button module anda display module, the button module is used for setting actions of the device, the display module can display state information of the device in real time, and the operating panel is connected with aninput end of a PLC (programmable logic controller). The method effectively solves the problems and can be used for wire rubber coating.
Description
technical field [0001] The invention relates to an encapsulation method based on an electric wire encapsulation device. Background technique [0002] In general electric wires, in order to prevent accidents such as short circuit and electric leakage during use, the electric wire production industry will evenly and tightly wrap a layer of non-conductive material around the wire, such as: resin, plastic, silicone rubber, etc., to form Insulation layer, so as to prevent the electrical leakage, short circuit, electric shock and other accidents caused by the contact between the conductor and the outside world. However, in the existing wire encapsulation technology, the surface of the wire is generally insulated by dipping. This method of outsourcing insulation is inefficient, and the thickness of the encapsulation is uneven, and the gap after encapsulation is large, which is easy Wire core deviation occurs. There are also some straight-through rubber covering devices in the ind...
Claims
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Login to View More IPC IPC(8): H01B13/14
CPCH01B13/14H01B13/145H01B13/147
Inventor 周欢生
Owner 深圳市伟隆盛电子有限公司