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An integrated power module

A technology of power modules and control modules, which is applied in the field of integrated power modules, can solve the problems of low integration and achieve the effect of improving the degree of generalization

Active Publication Date: 2019-11-29
CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Power semiconductor devices are widely used in rail transit, industrial frequency conversion and other fields, but standard package power semiconductor devices only have the function of switching tubes, and the integration level is not high

Method used

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  • An integrated power module
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Embodiment Construction

[0038] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings and examples, so as to fully understand and implement the process of how to apply technical means to solve technical problems and achieve technical effects in the present invention. It should be noted that, as long as there is no conflict, each embodiment and each feature in each embodiment of the present invention can be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

[0039] Also, in the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without the specific details or in the particular manner described.

[0040] Aiming at the problems existing in the prior...

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Abstract

An integrated power module comprises a heat radiator layer, a main circuit layer and a control circuit, wherein the main circuit layer comprises a three-phase bridge arm power semiconductor circuit and at least two sets of lining plates, the first set of lining plates and the second set of lining plates are arranged on the first side surface and the second side surface of the heat radiator layer in a contact manner, and power semiconductor chips in the three-phase bridge arm power semiconductor circuit are arranged on the first set of lining plates and the second set of lining plates in groups; and the control circuit is electrically connected with the three-phase bridge arm power semiconductor circuit, and is used for controlling operating states of the three-phase bridge arm power semiconductor circuit. Compared with the existing power semiconductors, the integrated power module integrates the control circuit inside equipment, such that a control circuit does not need to be additionally configured in operation, thereby enabling the H-bridge arm double-side heat dissipation power module to realize intelligent control functions such as driving, monitoring, protecting and diagnosis,and improving the universality degree of the equipment.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to an integrated power module. Background technique [0002] Power semiconductor devices are widely used in rail transit, industrial frequency conversion and other fields, but standard package power semiconductor devices only have the function of switching tubes, and the integration level is not high. As one of the core components of the converter, the converter module is composed of standard packaged power semiconductor devices, heat sinks, low-inductance busbars, gate drivers and structural parts, etc., due to the limitations of structural form, device layout and device functions , There are still many imperfections in terms of power density, intelligence and convenient application. Contents of the invention [0003] In order to solve the above problems, the present invention provides an integrated power module, which includes: [0004] radiator layer; [0005] The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L25/07
CPCH01L23/367H01L25/072
Inventor 王晓元范伟金肩舸杨进锋李彦涌彭凯彭银中漆宇王雄杨涛
Owner CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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