Method and system for testing through-hole loss

Abstract

The invention provides a method and system for testing through-hole loss. The invention provides a method and a system for testing the through-hole loss. The method for testing the through-hole loss comprises the steps of providing a circuit board, wherein the circuit board comprises three pairs of differential lines with the same length, and a plurality of sets of through holes are formed in thefirst pair of differential lines, and the second pair of differential lines and the third pair of differential lines are not provided with through holes; respectively measuring the insertion losses ofthe first pair of differential lines, the second pair of differential lines and the third pair of differential lines; and performing AFR de-embedding on the first pair of differential lines by usingthe second pair of differential lines and the third pair of differential lines to obtain the through-hole loss. According to the invention, the influence of the PCB glass fiber effect and the processerror is reduced to a great extent, so that the loss of the measured differential through hole is more accurate.

Description

technical field [0001] The present application generally relates to the fields of electronic technology and performance measurement, and more particularly, to a method and system for testing via loss. Background technique [0002] With the high-speed development of various differential interconnection signal rates on the server Printed Circuit Board (PCB) board, and the limitation of total link loss by various protocols, the requirements for signal integrity are becoming increasingly stringent. For the complete link on the PCB wiring (also known as wiring) of the server, there are many factors that affect the signal integrity. Only by optimizing each discontinuous structure can a margin be left, so as to design a cost-effective and A link that meets the requirements of the protocol specification. Since there are connectors, inter-chip interconnections, space constraints, etc. in the wiring on the board, it is inevitable to introduce a signal layer change design, but the via...

AI Technical Summary

Problems solved by technology

[0005] 1. This kind of circuit board only considers the vias of single-ended lines. This design has little significance for high-speed signal lines of servers. Because high-speed lines are all designed with differential pairs, the vias should also be differential vias.

[0006] 2. This kind of circuit board adopts the method of TRL calibration line, but there is no special treatment for via wiring and calibration line

As the signal rate continues to increase, the glass fiber effect of the material must be taken into account. If the calibration line and the via line are just in the special situation that one is on the glass fiber cloth and the other is on the window, then for the via The calculation of the loss of the hole will have a large error

[0007] 3. The design does not consider the impact of process errors

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