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An automatic chip bonder

A technology for die bonding machines and chips, which is applied in the field of automatic die bonding machines, can solve problems such as error accumulation, and achieve the effect of simplifying equipment and facilitating maintenance.

Active Publication Date: 2019-08-09
广东深科电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the packaging process of the chip, it is necessary to place the semiconductor die on the workpiece to be processed for welding and bonding operations. Most of the current chip bonders set the dispensing head and the suction head separately. On the one hand, the dispensing head needs to be separately Alignment with the sticking point on the suction piece head and the workpiece to be processed is prone to error accumulation. On the other hand, more parts are needed and the problem of matching parts is overcome.

Method used

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  • An automatic chip bonder
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: refer to Figure 1-3 , an automatic chip bonder, including a controller, work, 10, frame 20, base plate 12, base plate transmission mechanism 11, vacuum suction head 22, vertical transmission mechanism 21, the base plate 12 is set on the workbench 10 through slide rails , the vacuum suction head 22 is arranged on the frame 20 through the vertical transmission mechanism 21, and the bottom plate 12 is provided with a processing disk 121, a tin glue disk 122 and a chip disk 123 along the y-axis direction, and the bottom plate transmission mechanism 11 is a screw transmission mechanism and is connected with Base plate 12 is driven and connected, and the direction of base plate transmission mechanism 11 transmission is the y-axis; The number is consistent with the number of pasting points of the workpiece to be processed on the processing tray 121 and corresponds one by one. Chip fixing grooves are set on the chip tray 123 and correspond to the plurality of suc...

Embodiment 2

[0030] Embodiment 2, with reference to Figure 4 , On the basis of Embodiment 1, the retaining ring 223 can also be a spiral sheet ring. The spiral sheet stopper ring 223 can accommodate more tin glue, and at the same time, the spiral sheet stopper ring 223 can buffer the solder glue going in and out of the suction head 222 to prevent the solder glue from splashing when it is inhaled or blown out.

Embodiment 3

[0031] Embodiment 3, with reference to Figure 5 , on the basis of embodiment 1 or embodiment 2, wherein the vacuum chamber 224 can also be the following shape: the lower end is circular, the upper end is rectangular and connected to each other, the upper end of the vacuum chamber 224 near the side wall of the vacuum chamber 221 and the vacuum chamber The side wall of 221 is tightly connected.

[0032]Generally speaking, the sticking points of workpieces to be processed on the processing tray 121 are regularly arranged, and the positions of the suction heads 222 are also regularly arranged. Therefore, setting the upper ends of the vacuum chambers 224 to be rectangular and connected to each other can also solve the problem of vacuum chambers 224. There is a gap problem between the upper ends, the vacuum chamber 224 can be integrally formed with the vacuum chamber 221 and the suction head 222 .

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PUM

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Abstract

The invention relate to the field of chip processing equipment, in particular to an automatic chip pasting machine. The automatic chip pasting machine comprises a controller, a workbench, a rack, a bottom plate, a bottom plate transmission mechanism, a vacuum suction head and a vertical transmission mechanism, wherein the bottom plate is arranged on the workbench by a sliding rail, the vacuum suction head is arranged on the rack via the vertical transmission mechanism, a processing disc, a tin glue disc and a chip disc are arranged on the bottom plate along a y-axis direction, a transmission direction of the bottom plate transmission mechanism is y axis, the vacuum suction head is arranged above the bottom plate and comprises a vacuum cavity and a suction head, the vacuum head communicateswith the vacuum cavity, the numbers of the suction heads are consistent with the numbers of pasting points of a workpiece to be processed on the processing disc in one-to-one correspondence, and chipfixing grooves are formed in the chip disc and are in one-to-one correspondence to the suction head. The automatic chip pasting machine has the advantages that the functions of a glue dispersion headand a suction sheet head are integrated onto the vacuum suction head, the equipment is simplified, equipment maintenance is facilitated, and the vacuum suction head is improved to improve the processing quality.

Description

technical field [0001] The invention relates to the field of chip processing equipment, in particular to an automatic chip bonding machine. Background technique [0002] During the packaging process of the chip, it is necessary to place the semiconductor die on the workpiece to be processed for welding and bonding operations. Most of the current chip bonders set the dispensing head and the suction head separately. On the one hand, the dispensing head needs to be separately Aligning the suction head with the sticking point on the workpiece to be processed is prone to error accumulation. On the other hand, more parts are needed and the problem of matching parts is overcome. Since both the glue dispensing head and the chip suction head move above the sticking point of the workpiece to be processed, the present invention combines the glue dispensing head and the chip suction head to obtain an automatic chip bonding machine. Contents of the invention [0003] The object of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 蔡明挽周悦贤
Owner 广东深科电子有限公司