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A kind of laser sintering method and laser sintering equipment

A laser sintering and laser head technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of affecting the packaging effect, unable to correspond to sintered Frit, laser head collision, etc.

Active Publication Date: 2019-08-27
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the gap between the Frits of two adjacent cells is relatively small compared to normal products, the small gap will cause two adjacent non-rotating laser heads to collide, making it impossible to sinter two adjacent cells correspondingly. Frit, greatly affects the encapsulation effect

Method used

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  • A kind of laser sintering method and laser sintering equipment
  • A kind of laser sintering method and laser sintering equipment
  • A kind of laser sintering method and laser sintering equipment

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Embodiment Construction

[0025] The specific implementation manners of the laser sintering method and the laser sintering equipment provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are only some of the embodiments of the present invention, not all of them; and in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other; In addition, based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] Specifically, a laser sintering method provided by an embodiment of the present invention, such as figure 1 As shown, specifically, the following steps may be included:

[0027] S101, setting multiple laser heads as rotary laser...

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Abstract

The invention discloses a laser sintering method and laser sintering equipment. The laser sintering method is characterized in that a plurality of laser heads are set to be rotary type laser heads; after a movement rate, a movement direction and an initial position of each rotary type laser head are set, and each rotary type laser head is controlled to keep a certain rotation angle in the motion process of adjacent sides of two sub display panels in a line direction, so that adjacent laser heads are prevented from colliding through rotation of the rotary type laser heads to realize sintering of adjacent Frit of two cells in case that a gap between Frit of the two adjacent cells is relatively normal and a product is relatively small, and therefore, an encapsulating effect is improved.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a laser sintering method and laser sintering equipment. Background technique [0002] In a rigid product of an organic light-emitting display (OLED) display panel, glass frit (Frit) is generally used to encapsulate the substrates on both sides of the OLED display panel. In this packaging method, Frit is formulated into a solution with a certain viscosity, coated on a substrate, heated to remove the solvent, and then bonded to another substrate to be packaged, and the Frit is burned to melt instantly by using a laser (Laser), so that the The two substrates are bonded together to achieve good packaging of the OLED display panel and achieve the purpose of isolating water and oxygen. [0003] At present, the uncut OLED motherboard includes multiple sub-display panels (cells). After packaging each cell with Frit, the OLED motherboard is cut to separate the cells. The cells after c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/20C03C27/10
Inventor 周桢力王婷
Owner BOE TECH GRP CO LTD