Flexible medium cutting method
A flexible medium and cutting method technology, applied in the direction of laser welding equipment, electrical components, circuits, etc., can solve the problems of consuming man-hours and materials, increasing the loss and use cost of laser cutting equipment, and high cost of using laser cutting equipment
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0043] This embodiment provides a cutting method for flexible media, see image 3 as well as Figure 4a-4e , the cutting method comprises the steps of:
[0044] S11, such as Figure 4a As shown, a flexible medium 10 to be cut is provided, the flexible medium comprising opposing first and second surfaces 10a, 10b. Wherein, the flexible medium 10 is, for example, a flexible OLED display panel, especially a fully flexible OLED display panel peeled off from a glass substrate.
[0045] S12, such as Figure 4bAs shown, a protective film 20 is pasted on the first surface 10 a of the flexible medium 10 . Wherein, the protective film 20 is selected as a protective film that has good adhesion to the flexible medium 10 and can be peeled off by mechanical force, preferably manually.
[0046] Wherein, the thickness of the protective film is selected to be greater than 100 μm. In a preferred technical solution, the thickness of the protective film is selected within the range of 100 μ...
Embodiment 2
[0054] This embodiment provides a method for cutting flexible media. The difference from Embodiment 1 is that it corresponds to step S13 in Embodiment 1. In this embodiment, the protective film 20 is not directly connected to the vacuum adsorption platform. 30, but on the vacuum adsorption platform 30 first connect a carrier component, and then connect the protective film 20 to the carrier component.
[0055] Such as Image 6 As shown, the vacuum adsorption platform 30 is provided with a carrier assembly 50, the flexible medium 10 attached with the protective film 20 is placed on the carrier assembly 50, the protective film 20 and the carrier assembly 50 connections. Wherein, the carrying assembly 50 is provided with a through hole 51 in fluid communication with the adsorption hole 31 of the vacuum adsorption platform 30, and the through hole 51 transmits the vacuum adsorption force generated by the vacuum adsorption platform 30 to the protection device. film 20 to absorb an...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


