Water-soluble photosensitive resin composition, cover film and circuit board

A photosensitive resin, water-soluble technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as easy pollution of the environment, hidden safety hazards, environmental pollution, etc., achieve strong adhesion, save resources, and reduce storage costs Effect

Active Publication Date: 2018-07-10
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of organic solvents is not only easy to pollute the environment, but also accumulates in the exhaust pipe of the oven for a long time after evaporation, which poses a safety hazard
In addition, in the process of using the above-me

Method used

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  • Water-soluble photosensitive resin composition, cover film and circuit board
  • Water-soluble photosensitive resin composition, cover film and circuit board
  • Water-soluble photosensitive resin composition, cover film and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0052] The preparation method of the water-soluble photosensitive resin composition can be: adding the oxazoline group-containing polymer, photosensitive monomer, photoinitiator, colorant, pure water, etc. into a reaction flask in a predetermined ratio, mixing and stirring, The oxazoline group-containing polymer, photosensitive monomer, photoinitiator, and color are mixed to obtain a water-soluble photosensitive resin composition. The addition amount of the pure water can be changed as needed, as long as the oxazoline group-containing polymer, photosensitive monomer, photoinitiator, and colorant can be completely dissolved or completely dispersed.

[0053] See figure 1 , A cover film 100 comprising a photosensitive resin layer 20 and a release film 10 bonded to at least one surface of the photosensitive resin layer 20. The photosensitive resin layer 20 is formed by coating the above-mentioned water-soluble photosensitive resin composition on the surface of the release film 10. I...

Example Embodiment

[0057] Example 1

[0058] Into a reaction flask with a volume of 500ml, 100g of polymer containing oxazoline groups, 40g of ethoxylated trimethylolpropane tri(meth)acrylate, 8g of phenylbis(2,4,6-tri (Methylbenzoyl) phosphine oxide, 2g color material, 100g pure water, 30g barium sulfate, stir and dissolve to obtain a water-soluble photosensitive resin composition.

[0059] Wherein, the molecular weight of the oxazoline group-containing polymer is 20000 g / mol.

Example Embodiment

[0060] Example 2

[0061] Into a 500ml reaction flask, 100g of oxazoline-containing polymer, 20g of ethoxylated trimethylolpropane tri(meth)acrylate, 8g of phenylbis(2,4,6-tri (Methylbenzoyl) phosphine oxide, 2g of colorant, 100g of pure water, 15g of barium sulfate, stir and dissolve to obtain a water-soluble photosensitive resin composition.

[0062] Wherein, the molecular weight of the oxazoline group-containing polymer is 20000 g / mol.

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Abstract

A water-soluble photosensitive resin composition comprises a polymer containing oxazolinyl, a photosensitive monomer and a photoinitiator, wherein the polymer containing oxazolinyl, the photosensitivemonomer and the photoinitiator have water solubility or water dispersibility, the polymer containing oxazolinyl and the photosensitive monomer contain carbon-carbon double bonds, and under irradiation of ultraviolet light, the polymer containing oxazolinyl and the photosensitive monomer can be in cross-linking reaction under initiation of a photoinitiator and then are solidified to form a compactnet-shaped structure. The photosensitive resin layer prepared from the water-soluble photosensitive resin composition has waterborne developing property. Compared with an existing photosensitive resin composition which takes an organic solvent as a solvent and needs to develop under an alkaline condition, the water-soluble photosensitive resin composition has the advantages of environmental protection, safety and resource conservation. Furthermore, the invention provides a covering film prepared from the water-soluble photosensitive resin composition and a circuit board manufactured by use ofthe covering film.

Description

technical field [0001] The invention relates to a water-soluble photosensitive resin composition, a cover film made from the water-soluble photosensitive resin composition, and a circuit board made using the cover film. Background technique [0002] In recent years, printed circuit boards have been widely used in various electronic products. At present, the photosensitive materials used in printed circuit boards are mainly solder resist green paint inks, which can provide a heat-resistant, moisture-resistant, and chemical-resistant outer protective layer for exposed conductive lines to prevent soldering. Lead or solder can cause short circuit of the circuit, and at the same time, it can protect the metal conductive circuit from the corrosion of corrosive solutions such as acid and alkali. [0003] At present, the solder resist green paint inks on the market need to use a large amount of organic solvents such as monomethyl ether propylene glycol acetate (PGMEA), butanone (ME...

Claims

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Application Information

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IPC IPC(8): G03F7/027H05K1/03H05K3/28
CPCG03F7/027H05K1/0353H05K3/287
Inventor 颜振锋李昌鸿林义芳萧嬿芹向首睿徐茂峰
Owner ZHEN DING TECH CO LTD
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