Thermally conductive composition via coating on plastics

Abstract

An article may comprise a substrate formed from a thermoplastic or thermoset; and a thermal conductive or heat absorptive coating disposed adjacent the substrate to form a composite stack, wherein thecomposite stack is characterized by an increase of through plane thermal conductivity of at least 2 W / m*K, when compared to the substrate without the coating.

Description

[0001] related application [0002] This application claims the benefit of US Patent Application No. 62 / 248,455, filed October 30, 2015, the disclosure of which is incorporated herein in its entirety. Background technique [0003] For consumer electronic devices, heat buildup during use can reduce device efficiency and can shorten lifetime. From the user's point of view, the accumulated heat may be uncomfortable to the touch. Therefore, thermal management, such as heat dissipation, is critical to such devices and their use. As an example, adding thermally conductive fillers to thermoplastic or thermoset materials is an effective way to increase thermal conductivity, and such thermally conductive compositions can be used in consumer electronic devices to dissipate heat. However, consumer electronics are constantly evolving and include mobile devices with increasing electronics functionality, power, and larger display screens, which result in more heat being generated during u...

AI Technical Summary

Problems solved by technology

Exacerbating the problem, consumer electronics are being manufactured in thinner designs, limiting space for cooling and requiring higher thermal conductivity

This level of thermal conductivity cannot be achieved by adding additional thermally conductive fillers due to the limited thermal conductivity of the utilized fillers

In addition, an increase in thermally conductive filler loading can lead to undesired effects related, for example, to mechanical properties and flame retardant (FR) properties

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