A buffer device and its manufacturing method, backlight module, display device and its manufacturing method

Abstract

The invention discloses a buffer device and a manufacturing method thereof, a backlight module, a display device and a manufacturing method thereof, and relates to the field of display technology, in order to reduce foreign objects entering the display on the premise of improving the assembly accuracy between the display panel and the backlight module. The probability of the device is improved, and the L0 light leakage phenomenon of the display device is reduced. The buffer device includes a buffer body and a hollow buffer layer formed on the buffer body, the hollow buffer layer includes a plurality of hollow parts and a plurality of non-hollow parts, and the buffer body corresponds to the surface of the hollow part of the hollow buffer layer An adhesive layer is formed. The backlight module includes the buffer device mentioned in the above technical solution. The buffer device, the backlight module, the display device and the manufacturing method thereof provided by the invention are used in the manufacture of the display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a buffer device and a manufacturing method thereof, a backlight module, a display device and a manufacturing method thereof. Background technique [0002] Liquid crystal display (Liquid Crystal Display, LCD) has the advantages of good picture quality, thin profile, low power consumption, etc., and is widely used in various fields such as mobile display, consumer communication or electronic products; such as figure 1 and figure 2 As shown, the existing liquid crystal display includes a backlight module 1 and a display panel 2 arranged on the light emitting surface of the backlight module. [0003] Among them, such as figure 1 and figure 2 As shown, a buffer device 3 is provided on the plastic frame of the backlight module 1 , and an adhesive layer is formed on the surface of the buffer device 3 contacting the display panel 2 to prevent foreign matter from entering the gap be...

AI Technical Summary

Problems solved by technology

However, if image 3 and Figure 4 As shown, if the surface of the plastic frame of the backlight module 1 is uneven, it is easy for the buffer device 3 to exert a certain force on the display panel 2, causing the display panel 2 to generate stress. There will be a whitening and shining phenomenon in the area of ​​the force, thereby forming L0 light leakage; moreover, since the buffer device 3 is in contact with the surface of the display panel to form an adhesive layer, so that the display panel 2 and the backlight module 1 are not aligned properly without accurate alignment. When they are bonded together, the relative position between the display panel 2 and the backlight module 1 cannot be adjusted, so that the assembly of the display panel 2 and the backlight module 1 is offset, which affects the product quality of the display device

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